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参数资料
| 型号： | AH3-G |
| 元件分类： | 放大器 |
| 英文描述： | 50 MHz - 870 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | GREEN, TO-243C, SOT-89, 3 PIN |
| 文件页数： | 4/4页 |
| 文件大小： | 114K |
| 代理商： | AH3-G |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com, www.TriQuint.com
Page 4 of 4 January 2008
AH3
High Dynamic Range Gain Block
AH3-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C reflow temperature) and leaded
(maximum 245
°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The AH3-G will be marked with an “AH3G”
designator.
An
alphanumeric
lot
code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
“AH3” designator followed by alphanumeric
lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Passes
500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
1000V to <2000V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device.
Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
XXXX-X
AH3G
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AH3WB-PCB | 功能描述:射频开发工具 50-450MHz Eval Brd 19dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
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| AH40012 | 制造商:Zettler Magnetics 功能描述:Transformer, Split Bobbin Pwr;6VA;Sec:0.500A;Pri:115V;Sec:12VCT;PC;1.313In.W 制造商:Zettler Magnetics 功能描述:Single 115V 6-Pin Power PCB Transformer - Horizontal Split Bobbin 制造商:ZETTLER MAGNETICS 功能描述:TRANSFORMER |
| AH400120 | 制造商:Zettler Magnetics 功能描述:Transformer, Split Bobbin Pwr;6VA;Sec:0.050A;Pri:115V;Sec:120VCT;PC;1.313In.W |
| AH40016 | 制造商:Zettler Magnetics 功能描述:Transformer, Split Bobbin Pwr;6VA;Sec:0.400A;Pri:115V;Sec:16VCT;PC;1.313In.W |
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