- 您现在的位置：买卖IC网 > PDF目录92914 > AH312-1S8G 400 MHz - 2300 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER PDF资料下载
参数资料
| 型号： | AH312-1S8G |
| 元件分类： | 放大器 |
| 英文描述： | 400 MHz - 2300 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | GREEN, SOIC-8 |
| 文件页数： | 7/7页 |
| 文件大小： | 369K |
| 代理商： | AH312-1S8G |
Specifications and information are subject to change without notice.
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com, www.TriQuint.com
Page 7 of 7 March 2008
AH312-1
2 Watt, High Linearity InGaP HBT Amplifier
AH312-1S8G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
AH312G
1
Mounting Configuration / Land Pattern
Product Marking
The component will be marked with an
“AH312G” designator with an alphanumeric lot
code on the top surface of the package. A “1”
will be lasermarked in the upper right hand
corner.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 2 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is strictly required for proper thermal operation.
Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in degrees.
相关PDF资料 |
PDF描述 |
|---|---|
| AH312-1S8G | 400 MHz - 2300 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AH312 | 400 MHz - 2300 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AH312 | 400 MHz - 2300 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AH314 | 2300 MHz - 2900 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| AH31 | 50 MHz - 500 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AH312-RFID | 制造商:WJCI 制造商全称:WJCI 功能描述:2 Watt, High Linearity InGaP HBT Amplifier |
| AH312-S8 | 制造商:WJCI 制造商全称:WJCI 功能描述:2 Watt, High Linearity InGaP HBT Amplifier |
| AH312-S8G | 功能描述:射频放大器 400-2300MHz 18dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AH312-S8PCB1960 | 功能描述:射频开发工具 1960MHz Eval Brd 11dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| AH312-S8PCB2140 | 功能描述:射频开发工具 2140MHz Eval Brd 10dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
发布紧急采购，3分钟左右您将得到回复。