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参数资料
| 型号： | AIC1742-18APVTR |
| 厂商： | Analog Integrations Corporation |
| 元件分类： | 基准电压源/电流源 |
| 英文描述： | 1.5A Fast Ultra Low Dropout Linear Regulators |
| 中文描述： | 1.5A的快速超低压差线性稳压器 |
| 文件页数： | 10/12页 |
| 文件大小： | 639K |
| 代理商： | AIC1742-18APVTR |
AIC1742
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability.
Input capacitor
at 1
μ
F with 1uF aluminum electrolytic or 2.2
μ
F
ceramic output capacitor is recommended. And
it should be selected within the Equivalent
Series Resistance (ESR) range as shown in
the figure 20
,
21. ESR of ceramic capacitor is
lower
and
its
electrical
(capacitance and ESR) vary widely over
temperature. In general, tantalum or electric
output capacitor is suggested for heavy load.
Normally, the output capacitor should be 1
μ
F
(aluminum electrolytic) at least and rates for
operating temperature range. Note that it’s
important to check selected manufactures
electrical characteristics (capacitance and ESR)
over temperature.
characteristics
NOISE BYPASS CAPACITOR
0.01
μ
F bypass capacitor at BP pin reduces
output voltage noise. And the BP pin has to
connect a capacitor to GND.
POWER DISSIPATION
The maximum power dissipation of AIC1742
depends on the thermal resistance of its case
and circuit board, the temperature difference
between the die junction and ambient air, and
the rate of airflow. The rate of temperature rise
is greatly affected by the mounting pad
configuration on the PCB, the board material,
and the ambient temperature. When the IC
mounting with good thermal conductivity is
used, the junction temperature will be low even
when large power dissipation applies.
The power dissipation across the device is
P = I
OUT
(V
IN
-V
OUT
).
The maximum power dissipation is:
)
R
θ
(R
θ
)
T
(T
P
BA
JB
A
J
MAX
+
=
Where T
J
-T
A
is the temperature difference
between the die junction and the surrounding
air, R
θ
JB
is the thermal resistance of the
package, and R
θ
BA
is the thermal resistance
through the PCB, copper traces, and other
materials to the surrounding air.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum
thermal conductivity to maintain low device
temperature.
GND pin performs a dual function of providing
an electrical connection to ground and
channeling heat away. Therefore, connecting
the GND pin to ground with a large pad or
ground plane would increase the power
dissipation and reduce the device temperature.
10
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相关代理商/技术参数 |
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|---|---|
| AIC1742-18BCVBG | 制造商:AIC 制造商全称:Analog Intergrations Corporation 功能描述:Low Noise, Low Quiescent Current, 150mA Linear Regulator with Noise Bypass |
| AIC1742-18BCVTR | 制造商:AIC 制造商全称:Analog Intergrations Corporation 功能描述:Low Noise, Low Quiescent Current, 150mA Linear Regulator with Noise Bypass |
| AIC1742-18BPVBG | 制造商:AIC 制造商全称:Analog Intergrations Corporation 功能描述:Low Noise, Low Quiescent Current, 150mA Linear Regulator with Noise Bypass |
| AIC1742-18BPVTR | 制造商:AIC 制造商全称:Analog Intergrations Corporation 功能描述:Low Noise, Low Quiescent Current, 150mA Linear Regulator with Noise Bypass |
| AIC1742-20ACVBG | 制造商:AIC 制造商全称:Analog Intergrations Corporation 功能描述:Low Noise, Low Quiescent Current, 150mA Linear Regulator with Noise Bypass |
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