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参数资料
| 型号： | AL02HTN17 |
| 厂商： | STACKPOLE ELECTRONICS INC |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.017 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP, 0402 |
| 文件页数： | 3/11页 |
| 文件大小： | 2352K |
| 代理商： | AL02HTN17 |
Packaging
C
T
W
A
B
R
Re
ee
ell S
Sp
pe
ecciiffiicca
attiio
on
nss &
& P
Pa
acckka
ag
giin
ng
g Q
Qu
ua
an
nttiittyy
Unit: mm
Codes
ΦA
ΦB
ΦC
W
T
Paper Tape (EA)
AL02
178±1
60.2±0.5
13.0±0.50
13.2±1.50
16.0±0.20
10,000
AL03
178±1
60.0+0.5
13.0±0.20
9.00±0.5
12.0±0.15
5,000
P
Pa
ap
pe
err T
Ta
ap
pe
e S
Sp
pe
ecciiffiicca
attiio
on
nss
Unit: mm
Codes
A
B
W
E
F
P0
P1
P2
ψD0
T
AL02
0.67±0.03
1.15±0.03
8.00±0.10
1.75±0.05
3.5±0.05
4.00±0.10
2.00±0.05
1.54±0.03
0.40±0.03
AL03
1.10±0.05
1.90±0.05
8.00±0.10
1.75±0.05
3.5±0.05
4.00±0.10
2.00±0.05
1.55±0.05
0.60±0.03
Environmental Characteristics
Item
Specification
Test Method
1 Bending Test
As SPEC.
JIS-C-5202-6.1.4
Bending Amplitude 3mm for 10 seconds
2 Dielectric Withstand Voltage
>100V
MIL-STD-202F Method 301.
Apply 100VA (rms) for 1minute.
3 Insulation Resistance
>1000M
MIL-STD-202F Method 302
Apply 100VDC for 1minute.
4 Resistance to Soldering Heat
L 10%
MIL-STD-202F Method 210E
260±5 , 10±1second
J
s
5 High Temperature Exposure
L 10%
JIS-C-5202-7.2
85±2 , 1000 +48/
J
-0 hours
6 Moisture Resistance
L 10%
MIL-STD-202F Method 103B
40±2 , 90~95%RH, 1000 +48/
J
-0 hours
7 Low Temperature Storage
L 10%
JIS-C-5202-7.1
-40±3 , 1000 +48/
J
-0 hours
8 Temperature Cycle
L 10%
JIS-C-5202-7.4
-40/RT/85/RT, 10 cycles
9 Solderability
95% min coverage
MIL-STD-202F Method 208H
260 ±5
J
,2±0.5(sec)
J
Storage Temperature :25 3J ; Humidity <80%RH
W
E
F
r D0
P1
P
2
P0
direction of unreeling
A
B
Top Tape
Bottom Tape
Resistor
PT
T
Toll Free: (888) SEI-SEIS
www.seielect.com
email: marketing@seielect.com
11
AL Series - Thin Film Chip Inductor
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| AL02GTN17 | 1 ELEMENT, 0.017 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| AL02GTN15 | 1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
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