参数资料
型号: AL8807W5-7
厂商: Diodes Inc
文件页数: 3/20页
文件大小: 0K
描述: IC LED DRVR DCDC BUCK SOT25
标准包装: 1
恒定电流:
拓扑: PWM,降压(降压)
输出数: 1
内部驱动器:
类型 - 主要: 通用
类型 - 次要: 白色 LED
频率: 1MHz
电源电压: 6 V ~ 36 V
输出电压: 36V
安装类型: 表面贴装
封装/外壳: SC-74A,SOT-753
供应商设备封装: SOT-25
包装: 标准包装
工作温度: -40°C ~ 125°C
其它名称: AL8807W5-7DIDKR
AL8807
Electrical Characteristics (@V IN = 12, T A = +25°C, unless otherwise specified.)
Symbol
V INSU
V INSH
I Q
Parameter
Internal Regulator Start-Up Threshold
Internal Regulator Hysteresis Threshold
Quiescent Current
Conditions
V IN rising
V IN falling
Output not switching (Note 4)
Min
100
Typ
Max
5.9
300
350
Unit
V
mV
μA
I S
V TH
V TH-H
I SET
R CTRL
V REF
R DS(on)
t R
t F
Input Supply Current
Set current Threshold Voltage
Set Threshold Hysteresis
SET Pin Input Current
CTRL Pin Input Resistance
Internal Reference Voltage
On Resistance of SW MOSFET
SW Rise Time
SW Fall Time
CTRL pin floating f = 250kHz
V SET = V IN -0.1
Referred to internal reference
I SW = 1A
V SENSE = 100±20mV, f SW = 250kHz
V SW = 0.1V to 12V to 0.1V, C L = 15pF
95
1.8
100
±20
16
50
2.5
0.25
12
20
5
105
22
0.4
mA
mV
mV
μA
k ?
V
?
ns
ns
I SW_Leakage Switch Leakage Current
V IN =30V
0.5
μ A
? JA
? JL
? JC
Thermal Resistance Junction-to-Ambient (Note 5)
Thermal Resistance Junction-to-Lead (Note 8)
Thermal Resistance Junction-to-case (Note 9)
SOT25 (Note 6)
MSOP-8EP (Note 7)
SOT25 (Note 6)
MSOP-8EP (Note 7)
250
69
50
4.3
? C/W
Notes:
4. AL8807 does not have a low power standby mode but current consumption is reduced when output switch is inhibited: V SENSE = 0V. Parameter is
tested with V CTRL ≤ 2.5V
5. Refer to figure 35 for the device derating curve.
6. Test condition for SOT25: Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top layer and thermal
vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
7. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
8. Dominant conduction path via Gnd pin (pin 2).
9. Dominant conduction path via exposed pad.
AL8807
Document number: DS35281 Rev. 5 - 2
3 of 20
www.diodes.com
March 2013
? Diodes Incorporated
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