参数资料
型号: AM29BL162CB-9DGH1
厂商: Spansion Inc.
英文描述: 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
中文描述: 16兆位(1米× 16位),3.0伏的CMOS只,突发性,引导扇区闪存模式模修订1
文件页数: 14/19页
文件大小: 151K
代理商: AM29BL162CB-9DGH1
S U P P L E M E N T
Am29BL162C Known Good Die
13
PACKAGING INFORMATION
Surftape Packaging
Gel-Pak and Waffle Pack Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
1
AMD logo location
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
相关PDF资料
PDF描述
AM29BL162CB-9DGI1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-9DPE1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-9DPH1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-9DPI1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-9DTH1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
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