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参数资料
| 型号： | AM29BL802CB80DWH1 |
| 厂商： | Spansion Inc. |
| 英文描述： | 8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1 |
| 中文描述： | 8兆位（512亩× 16位），3.0伏的CMOS只，突发性，引导扇区闪存模式模修订1 |
| 文件页数： | 12/17页 |
| 文件大小： | 146K |
| 代理商： | AM29BL802CB80DWH1 |
S U P P L E M E N T
Am29BL802C Known Good Die
11
PACKAGING INFORMATION
Surftape Packaging
Gel-Pak and Waffle Pack Packaging
Direction of Feed
Orientation relative to
leading edge of tape
and reel
1
AMD logo location
Orientation relative to
top left corner of
Gel-Pak
and Waffle Pack
cavity plate
AMD logo location
相关PDF资料 |
PDF描述 |
|---|---|
| AM29BL802CB80DWI1 | 8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1 |
| AM29DL320GB70PCIN | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320GT120 | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320GT70WDI | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320GB70WDI | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
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参数描述 |
|---|---|
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| AM29C116-1JC | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| AM29C116-2JC | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Advanced Micro Devices 功能描述: 制造商:AMD 功能描述: |
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