- 您现在的位置：买卖IC网 > PDF目录375291 > AM29DL320GB90 (Spansion Inc.) For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. PDF资料下载
参数资料
| 型号： | AM29DL320GB90 |
| 厂商： | Spansion Inc. |
| 英文描述： | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| 中文描述： | 对于新的设计，涉及TSOP封装，S29JL032H会取代Am29DL320G，是厂家推荐的迁移路径。 |
| 文件页数： | 5/58页 |
| 文件大小： | 1239K |
| 代理商： | AM29DL320GB90 |
第1页第2页第3页第4页当前第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页
September 27, 2004
Am29DL320G
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .6
Special Package Handling Instructions ..........................................7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .10
Table 1. Device Bus Operations ...........................................................10
Word/Byte Configuration ..............................................................10
Requirements for Reading Array Data .........................................10
Writing Commands/Command Sequences ..................................11
Accelerated Program Operation ...................................................11
Autoselect Functions ....................................................................11
Simultaneous Read/Write Operations
with ZeroLatency .........................................................................11
Standby Mode ..............................................................................11
Automatic Sleep Mode .................................................................11
RESET#: Hardware Reset Pin .....................................................12
Output Disable Mode ...................................................................12
Table 2. Top Boot Sector Addresses ...................................................13
Table 3. Top Boot SecSi
TM
Sector Addresses..................................... 14
Table 4. Bottom Boot Sector Addresses ...............................................15
Table 5. Bottom Boot SecSi
TM
Sector Addresses................................ 16
Autoselect Mode ..........................................................................17
Table 6. Autoselect Codes, (High Voltage Method) .............................17
Sector/Sector Block Protection and Unprotection ........................18
Table 7. Top Boot Sector/Sector Block Addresses
forProtection/Unprotection ...................................................................18
Table 8. Bottom Boot Sector/Sector Block Addresses
forProtection/Unprotection ...................................................................18
Write Protect (WP#) .....................................................................19
Temporary Sector Unprotect ........................................................19
Figure 1. Temporary Sector Unprotect Operation................................. 19
Figure 2. In-System Sector Protection/
Sector Unprotection Algorithms............................................................ 20
SecSi
TM
(Secured Silicon) Sector
Flash MemoryRegion ..................................................................21
Factory Locked: SecSi Sector Programmed and Protected At the
Factory .........................................................................................21
Customer Lockable: SecSi Sector NOT Programmed or Protected At
the Factory ...................................................................................21
Figure 3. SecSi Sector Protect Verify.................................................... 22
Hardware Data Protection ............................................................22
Low VCC Write Inhibit ..................................................................22
Write Pulse “Glitch” Protection .....................................................22
Logical Inhibit ...............................................................................22
Power-Up Write Inhibit .................................................................22
Common Flash Memory Interface (CFI) . . . . . . . 22
Table 9. CFI Query Identification String................................................ 23
Table 10. System Interface String......................................................... 23
Table 11. Device Geometry Definition.................................................. 24
Table 12. Primary Vendor-Specific Extended Query............................ 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . .25
Reading Array Data ......................................................................25
Reset Command ..........................................................................25
Autoselect Command Sequence ..................................................25
Enter SecSi
TM
Sector/Exit SecSi Sector
Command Sequence ...................................................................26
Byte/Word Program Command Sequence ...................................26
Unlock Bypass Command Sequence ...........................................26
Figure 4. Program Operation................................................................ 27
Chip Erase Command Sequence .................................................27
Sector Erase Command Sequence ..............................................27
Erase Suspend/Erase Resume Commands ................................28
Figure 5. Erase Operation.................................................................... 28
Table 13. Command Definitions........................................................... 29
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
DQ7: Data# Polling ......................................................................30
Figure 6. Data# Polling Algorithm......................................................... 30
RY/BY#: Ready/Busy# .................................................................31
DQ6: Toggle Bit I ..........................................................................31
Figure 7. Toggle Bit Algorithm.............................................................. 31
DQ2: Toggle Bit II .........................................................................32
Reading Toggle Bits DQ6/DQ2 ....................................................32
DQ5: Exceeded Timing Limits ......................................................32
DQ3: Sector Erase Timer .............................................................32
Table 14. Write Operation Status .........................................................33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 8. Maximum Negative OvershootWaveform............................. 34
Figure 9. Maximum Positive OvershootWaveform.............................. 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 10. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents).................................................................... 36
Figure 11. Typical I
vs. Frequency................................................... 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 12. Test Setup.......................................................................... 37
Figure 13. Input Waveforms and Measurement Levels........................ 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 14. Read Operation Timings...................................................... 38
Figure 15. Reset Timings...................................................................... 39
Word/Byte Configuration (BYTE#) ...............................................40
Figure 16. BYTE# Timings for Read Operations.................................. 40
Figure 17. BYTE# Timings for Write Operations.................................. 40
Erase and Program Operations ...................................................41
Figure 18. Program Operation Timings................................................ 42
Figure 19. Accelerated Program Timing Diagram................................ 42
Figure 20. Chip/Sector Erase Operation Timings................................. 43
Figure 21. Back-to-back Read/Write Cycle Timings............................. 44
Figure 22. Data# Polling Timings (During EmbeddedAlgorithms)....... 44
Figure 23. Toggle Bit Timings (During EmbeddedAlgorithms)............ 45
Figure 24. DQ2 vs. DQ6....................................................................... 45
Temporary Sector Unprotect ........................................................46
Figure 25. Temporary Sector Unprotect Timing Diagram..................... 46
Figure 26. Sector/Sector Block Protect and Unprotect TimingDiagram 47
Alternate CE# Controlled Erase and ProgramOperations ...........48
Figure 27. Alternate CE# Controlled Write (Erase/Program)
OperationTimings................................................................................ 49
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 50
TSOP And SO Pin Capacitance. . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51
FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA)8x14mm .51
FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm .........................52
TS 048—Thin Small Outline Package ..........................................53
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
相关PDF资料 |
PDF描述 |
|---|---|
| AM29DL320GT70WMI | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320GT90 | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320G | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320GB120 | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
| AM29DL320GB70 | For new designs involving TSOP packages, S29JL032H supercedes Am29DL320G and is the factory-recommended migration path. |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AM29DL322DB7REIT | 制造商:AMD 功能描述:New |
| AM29DL322DB-90WDIT | 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 32MBIT 4MX8/2MX16 90NS 63FBGA - Tape and Reel |
| AM29DL322DT-90EI-T | 制造商:Advanced Micro Devices 功能描述: |
| AM29DL322GB-90EI | 制造商:Advanced Micro Devices 功能描述:2M X 16 FLASH 3V PROM, 90 ns, 48 Pin Plastic SMT |
| AM29DL322GT-90EI | 制造商:Advanced Micro Devices 功能描述:Flash Mem Parallel 3.3V 32M-Bit 4M x 8/2M x 16 90ns 48-Pin TSOP |
发布紧急采购，3分钟左右您将得到回复。