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| 型号： | AM29F010B70EE |
| 厂商： | Spansion Inc. |
| 英文描述： | Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaP; LED Color:Green; Leaded Process Compatible:Yes; Luminous Intensity:2.8mcd RoHS Compliant: Yes |
| 中文描述： | 1兆位（128亩× 8位）的CMOS 5.0伏只，统一部门快闪记忆体 |
| 文件页数： | 4/35页 |
| 文件大小： | 849K |
| 代理商： | AM29F010B70EE |
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November 18, 2002
Am29F010B
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .9
Table 1. Am29F010B Device Bus Operations .................................9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ..............................9
Programand Erase Operation Status ....................................10
Standby Mode ........................................................................10
Output Disable Mode ..............................................................10
Table 2. Am29F010B Sector Addresses Table ...............................10
Autoselect Mode .....................................................................10
Table 3. Am29F010B Autoselect Codes (High Voltage Method) ....11
Sector Protection/Unprotection ...............................................11
Hardware Data Protection ......................................................11
Low V
CC
Write Inhibit ......................................................................11
Write Pulse “Glitch” Protection ........................................................11
Logical Inhibit ..................................................................................11
Power-Up Write Inhibit ....................................................................11
Command Definitions . . . . . . . . . . . . . . . . . . . . . .12
Reading Array Data ................................................................12
Reset Command .....................................................................12
Autoselect Command Sequence ............................................12
Byte ProgramCommand Sequence .......................................12
Figure 1. ProgramOperation ..........................................................13
Chip Erase Command Sequence ...........................................13
Sector Erase Command Sequence ........................................13
Erase Suspend/Erase Resume Commands ...........................14
Figure 2. Erase Operation ...............................................................14
Command Definitions .............................................................15
Table 4. Am29F010B Command Definitions ...................................15
Write Operation Status . . . . . . . . . . . . . . . . . . . . .16
DQ7: Data#Polling .................................................................16
Figure 3. Data#Polling Algorithm...................................................16
DQ6: Toggle Bit I ....................................................................16
Reading Toggle Bit DQ6 .........................................................17
Figure 4. Toggle Bit Algorithm.........................................................17
DQ5: Exceeded Timng Limts ................................................17
DQ3: Sector Erase Timer .......................................................18
Table 5. Write Operation Status .....................................................18
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 19
Figure 5. MaximumNegative OvershootWaveform......................19
Figure 6. MaximumPositive OvershootWaveform........................19
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 19
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 7. Test Setup .......................................................................22
Table 6. Test Specifications ...........................................................22
Key to Switching Waveforms . . . . . . . . . . . . . . . 22
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 8. Read Operations Timngs ...............................................23
Erase and ProgramOperations .........................................................24
Figure 9. ProgramOperation Timngs ............................................25
Figure 10. Chip/Sector Erase Operation Timngs ..........................25
Figure 11. Data#Polling Timngs (During Embedded Algorithms) .26
Figure 12. Toggle Bit Timngs (During Embedded Algorithms) ......26
Erase and ProgramOperations .........................................................27
Alternate CE#Controlled Writes ....................................................27
Figure 13. Alternate CE#Controlled Write Operation Timngs ......28
Erase and Programming Performance . . . . . . . 28
Latchup Characteristic . . . . . . . . . . . . . . . . . . . . 29
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . 29
PLCC and PDIP Pin Capacitance . . . . . . . . . . . . 29
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 30
PD 032—32-Pin Plastic DIP ...................................................30
PL 032—32-Pin Plastic Leaded Chip Carrier .........................31
TS 032—32-Pin Standard Thin Small Outline Package .........32
TSR 032—32-Pin Standard Thin Small Outline Package .......33
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision A (August 12, 1999) .................................................34
Revision A+1 (September 22, 1999) ......................................34
Revision A+2 (September 27, 1999) ......................................34
Revision B (November 12, 1999) ............................................34
Revision C (November 28, 2000) ...........................................34
相关PDF资料 |
PDF描述 |
|---|---|
| AM29F010B70EI | Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaAsP; LED Color:Red; Leaded Process Compatible:Yes; Luminous Intensity:3.3mcd RoHS Compliant: Yes |
| AM29F010B70FC | Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaAsP; LED Color:Red; Leaded Process Compatible:Yes; Luminous Intensity:3.3mcd RoHS Compliant: Yes |
| AM29F010B70FE | LCD Character display; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes |
| AM29F010B70FI | LCD Character display; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes |
| AM29F010B70JC | Displays; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AM29F010B-70EF | 功能描述:闪存 1M (128Kx8) 70ns 5v Parallel NOR 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| AM29F010B-70EFT | 制造商:Spansion 功能描述:NOR Flash Parallel 5V 1Mbit 128K x 8bit 70ns 32-Pin TSOP T/R |
| AM29F010B-70EI | 制造商:Spansion 功能描述:FLASH PARALLEL 5V 1MBIT 128KX8 70NS 32TSOP - Trays 制造商:Spansion 功能描述:1 MEGABIT (128 K X 8-BIT) CMOS 5.0 VOLT- |
| AM29F010B-70EI\\T | 制造商:Spansion 功能描述:1M (128KX8) 5V, UNIFORM SECTOR, TSOP32, IND T/R - Tape and Reel |
| AM29F010B-70EI\T | 制造商:Spansion 功能描述:1M (128KX8) 5V, UNIFORM SECTOR, TSOP32, IND T/R - Tape and Reel |
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