参数资料
型号: AM29F010B70PI
厂商: Spansion Inc.
英文描述: 1 Megabit (128 K x 8-bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory
中文描述: 1兆位(128亩× 8位)的CMOS 5.0伏只,统一部门快闪记忆体
文件页数: 4/35页
文件大小: 849K
代理商: AM29F010B70PI
November 18, 2002
Am29F010B
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .9
Table 1. Am29F010B Device Bus Operations .................................9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ..............................9
Programand Erase Operation Status ....................................10
Standby Mode ........................................................................10
Output Disable Mode ..............................................................10
Table 2. Am29F010B Sector Addresses Table ...............................10
Autoselect Mode .....................................................................10
Table 3. Am29F010B Autoselect Codes (High Voltage Method) ....11
Sector Protection/Unprotection ...............................................11
Hardware Data Protection ......................................................11
Low V
CC
Write Inhibit ......................................................................11
Write Pulse “Glitch” Protection ........................................................11
Logical Inhibit ..................................................................................11
Power-Up Write Inhibit ....................................................................11
Command Definitions . . . . . . . . . . . . . . . . . . . . . .12
Reading Array Data ................................................................12
Reset Command .....................................................................12
Autoselect Command Sequence ............................................12
Byte ProgramCommand Sequence .......................................12
Figure 1. ProgramOperation ..........................................................13
Chip Erase Command Sequence ...........................................13
Sector Erase Command Sequence ........................................13
Erase Suspend/Erase Resume Commands ...........................14
Figure 2. Erase Operation ...............................................................14
Command Definitions .............................................................15
Table 4. Am29F010B Command Definitions ...................................15
Write Operation Status . . . . . . . . . . . . . . . . . . . . .16
DQ7: Data#Polling .................................................................16
Figure 3. Data#Polling Algorithm...................................................16
DQ6: Toggle Bit I ....................................................................16
Reading Toggle Bit DQ6 .........................................................17
Figure 4. Toggle Bit Algorithm.........................................................17
DQ5: Exceeded Timng Limts ................................................17
DQ3: Sector Erase Timer .......................................................18
Table 5. Write Operation Status .....................................................18
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 19
Figure 5. MaximumNegative OvershootWaveform......................19
Figure 6. MaximumPositive OvershootWaveform........................19
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 19
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 7. Test Setup .......................................................................22
Table 6. Test Specifications ...........................................................22
Key to Switching Waveforms . . . . . . . . . . . . . . . 22
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 8. Read Operations Timngs ...............................................23
Erase and ProgramOperations .........................................................24
Figure 9. ProgramOperation Timngs ............................................25
Figure 10. Chip/Sector Erase Operation Timngs ..........................25
Figure 11. Data#Polling Timngs (During Embedded Algorithms) .26
Figure 12. Toggle Bit Timngs (During Embedded Algorithms) ......26
Erase and ProgramOperations .........................................................27
Alternate CE#Controlled Writes ....................................................27
Figure 13. Alternate CE#Controlled Write Operation Timngs ......28
Erase and Programming Performance . . . . . . . 28
Latchup Characteristic . . . . . . . . . . . . . . . . . . . . 29
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . 29
PLCC and PDIP Pin Capacitance . . . . . . . . . . . . 29
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 30
PD 032—32-Pin Plastic DIP ...................................................30
PL 032—32-Pin Plastic Leaded Chip Carrier .........................31
TS 032—32-Pin Standard Thin Small Outline Package .........32
TSR 032—32-Pin Standard Thin Small Outline Package .......33
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision A (August 12, 1999) .................................................34
Revision A+1 (September 22, 1999) ......................................34
Revision A+2 (September 27, 1999) ......................................34
Revision B (November 12, 1999) ............................................34
Revision C (November 28, 2000) ...........................................34
相关PDF资料
PDF描述
AM29F010B70EC LCD Module; Leaded Process Compatible:Yes RoHS Compliant: Yes
AM29F010B70EE Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaP; LED Color:Green; Leaded Process Compatible:Yes; Luminous Intensity:2.8mcd RoHS Compliant: Yes
AM29F010B70EI Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaAsP; LED Color:Red; Leaded Process Compatible:Yes; Luminous Intensity:3.3mcd RoHS Compliant: Yes
AM29F010B70FC Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaAsP; LED Color:Red; Leaded Process Compatible:Yes; Luminous Intensity:3.3mcd RoHS Compliant: Yes
AM29F010B70FE LCD Character display; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
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