- 您现在的位置：买卖IC网 > PDF目录366430 > AM29F100T-150SIB (ADVANCED MICRO DEVICES INC) Quadruple 2-Input Positive-AND Gates 14-TSSOP -40 to 85 PDF资料下载
参数资料
| 型号： | AM29F100T-150SIB |
| 厂商： | ADVANCED MICRO DEVICES INC |
| 元件分类： | PROM |
| 英文描述： | Quadruple 2-Input Positive-AND Gates 14-TSSOP -40 to 85 |
| 中文描述： | 128K X 8 FLASH 5V PROM, 150 ns, PDSO44 |
| 封装： | SOP-44 |
| 文件页数： | 7/8页 |
| 文件大小： | 57K |
| 代理商： | AM29F100T-150SIB |
Am29F100 Known Good Die
7
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 266 mils x 142 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . .6.76 mm x 3.61 mm
Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm
Bond Pad Size . . . . . . . . . . . . . . 4.64 mils x 4.64 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 117.8
μ
m x 117.8
μ
m
Pad Area Free of Passivation . . . . . . . . . .21.53 mils
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,877
μ
m
2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Bond Pad Metalization. . . . . . . . . . . . . . . . . . Al/Si/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
CC
(Supply Voltage). . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias . .T
J
(max) = 130
°
C
Operating Temperature
. . . . . . . . . . . . . . . . . . . . . . Commercial 0
°
C to +70
°
C
Industrial . . . . . . . . . . . . . . . . . . .
–40
°
C to +85
°
C
Extended . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
MANUFACTURING INFORMATION
Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX
Manufacturing ID (Top Boot) . . . . . . . . . . . .98242AK
(Bottom Boot) . . . . . . . .98242ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°
C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°
C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
相关PDF资料 |
PDF描述 |
|---|---|
| AM29F100T-70EC | Quadruple 2-Input Positive-AND Gates 14-VQFN -40 to 85 |
| AM29F100T-70ECB | Quadruple 2-Input Positive-AND Gates 14-VQFN -40 to 85 |
| AM29F100T-70EE | 1 Megabit (128 K x 8-bit/64 K x 16-bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory |
| AM29F100T-70EEB | 1 Megabit (128 K x 8-bit/64 K x 16-bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory |
| AM29F100T-70EI | 1 Megabit (128 K x 8-bit/64 K x 16-bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AM29F100T-70EC | 制造商:Advanced Micro Devices 功能描述: |
| AM29F160DB-120EC | 制造商:Spansion 功能描述:16M (2MX8/1MX16) 5V, BOOT BLOCK, BOT, TSOP48, COM - Trays |
| AM29F160DB-120EI | 制造商:Spansion 功能描述:16M (2MX8/1MX16) 5V, BOOT BLOCK, BOT, TSOP48, IND - Trays |
| AM29F160DB-70ED | 制造商:Spansion 功能描述: |
| AM29F160DB-70EF | 功能描述:闪存 16Mb 70ns 5v Parallel NOR 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。