参数资料
型号: AM29LV065DU35WHF
厂商: Advanced Micro Devices, Inc.
英文描述: 64 Megabit (8 M x 8-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileIOTM Control
中文描述: 64兆位(8米× 8位)的CMOS 3.0伏特,只有统一部门闪光控制记忆与VersatileIOTM
文件页数: 5/54页
文件大小: 613K
代理商: AM29LV065DU35WHF
February 16, 2006
Am29LV065D
5
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 11
Table 1. Am29LV065D Device Bus Operations ..............................11
VersatileIO
TM
(V
IO
) Control ......................................................11
Requirements for Reading Array Data ...................................11
Writing Commands/Command Sequences ............................12
Accelerated Program Operation .............................................12
Autoselect Functions ..............................................................12
Standby Mode ........................................................................12
Automatic Sleep Mode ...........................................................12
RESET#: Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................13
Table 2. Sector Address Table ........................................................13
Autoselect Mode .....................................................................17
Table 3. Am29LV065D Autoselect Codes, (HighVoltageMethod) 17
Sector Group Protection and Unprotection .............................18
Table 4. Sector Group Protection/Unprotection AddressTable .....18
Temporary Sector Group Unprotect .......................................19
Figure 1. Temporary Sector Group UnprotectOperation................ 19
Figure 2. In-System Sector Group Protect/UnprotectAlgorithms... 20
SecSi (Secured Silicon) Sector Flash MemoryRegion ..........21
Table 5. SecSi Sector Contents ......................................................21
Figure 3. SecSi Sector Protect Verify.............................................. 22
Hardware Data Protection ......................................................22
Low VCC Write Inhibit ............................................................22
Write Pulse “Glitch” Protection ...............................................22
Logical Inhibit ..........................................................................22
Power-Up Write Inhibit ............................................................22
Common Flash Memory Interface (CFI). . . . . . . 22
Table 6. CFI Query Identification String.......................................... 23
System Interface String................................................................... 23
Table 8. Device Geometry Definition.............................................. 23
Table 9. Primary Vendor-Specific Extended Query........................ 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25
Reading Array Data ................................................................25
Reset Command .....................................................................25
Autoselect Command Sequence ............................................25
Enter SecSi Sector/Exit SecSi Sector
CommandSequence ..............................................................25
Byte Program Command Sequence .......................................26
Unlock Bypass Command Sequence .....................................26
Figure 4. Program Operation.......................................................... 26
Chip Erase Command Sequence ...........................................27
Sector Erase Command Sequence ........................................27
Erase Suspend/Erase Resume Commands ...........................27
Figure 5. Erase Operation............................................................... 28
Command Definitions .............................................................29
Table 10. Am29LV065D Command Definitions .............................29
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
DQ7: Data# Polling .................................................................30
Figure 6. Data# Polling Algorithm.................................................. 30
RY/BY#: Ready/Busy# ............................................................31
DQ6: Toggle Bit I ....................................................................31
Figure 7. Toggle Bit Algorithm........................................................ 31
DQ2: Toggle Bit II ...................................................................32
Reading Toggle Bits DQ6/DQ2 ...............................................32
DQ5: Exceeded Timing Limits ................................................32
DQ3: Sector Erase Timer .......................................................32
Table 11. Write Operation Status ...................................................33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 8. Maximum Negative OvershootWaveform..................... 34
Figure 9. Maximum Positive OvershootWaveform....................... 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 10. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 36
Figure 11. Typical I
vs. Frequency............................................ 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 12. Test Setup.................................................................... 37
Table 12. Test Specifications .........................................................37
Figure 13. Input Waveforms and MeasurementLevels................. 37
Key to Switching Waveforms. . . . . . . . . . . . . . . . 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Read-Only Operations ...........................................................38
Figure 14. Read Operation Timings............................................... 38
Hardware Reset (RESET#) ....................................................39
Figure 15. Reset Timings............................................................... 39
Erase and Program Operations ..............................................40
Figure 16. Program Operation Timings.......................................... 41
Figure 17. Accelerated Program Timing Diagram.......................... 41
Figure 18. Chip/Sector Erase Operation Timings.......................... 42
Figure 19. Data# Polling Timings (DuringEmbeddedAlgorithms). 43
Figure 20. Toggle Bit Timings (DuringEmbeddedAlgorithms)...... 44
Figure 21. DQ2 vs. DQ6................................................................. 44
Temporary Sector Unprotect ..................................................45
Figure 22. Temporary Sector Group UnprotectTimingDiagram... 45
Figure 23. Sector Group Protect and UnprotectTimingDiagram.. 46
Figure 24. Alternate CE# Controlled Write
(Erase/Program)OperationTimings.............................................. 48
Erase And Programming Performance . . . . . . . 49
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50
TS 048—48-Pin Standard Pinout Thin Small Outline
Package(TSOP) .....................................................................50
FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
11 x 12 mm package ..............................................................51
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