参数资料
型号: AMD-K5-PR133ABR
元件分类: 32位微控制器
英文描述: 32-Bit Microprocessor
中文描述: 32位微处理器
文件页数: 22/44页
文件大小: 2886K
代理商: AMD-K5-PR133ABR
14
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
tapes. (The latter is the least desirable from a thermal stand-
point, but the most desirable from a user installation stand-
point.)
Thermal Grease
Thermal grease is a compound composed of a carrier, conduc-
tor, and binder. The carrier is used to support the conductive
material. The conductor is a material of relatively low thermal
resistance and is added to the carrier as a filter. The binder is a
material that controls the viscosity of the compound. Thermal
grease is applied to both the heat sink and processor case to fill
air gaps between the two surfaces. When using thermal grease,
a heat sink clip is required. An example of thermal grease is
the Thermalcoate I manufactured by Thermalloy, Inc. The
thermal resistance of this material is p, expressed in units of
(
o
C · inch
2
) / watts.
Thermal Compounds
An alternative to silicone-based thermal greases (e.g., Sil-Free
by Aavid) is silicone-free thermal joint compound, which is
filled with metal oxide filler. These compounds were devel-
oped as an alternative to silicone grease and they do not
exhibit the deterioration or contamination associated with sili-
cone-based products. This material efficiently fills the air gaps
between the top of the processor case and the bottom of the
heat sink. When using these compounds, a heat sink clip is
required.
Thermal Grease with Aluminum Carrier
These products use an aluminum carrier with a typical thick-
ness of 0.004 inches and have uniform droplets of silicone
grease applied to both sides of the aluminum carrier. Both
sides have a protective paper coating that is removed prior to
installation. An example of this product is Conducta-Cote by
Thermalloy, Inc.
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