参数资料
型号: AMIS30523C5231RG
厂商: ON Semiconductor
文件页数: 5/35页
文件大小: 0K
描述: CAN MICRO STEPPER MOTOR DRIVER
标准包装: 1
应用: 步进电机控制器,2 相
输出数: 1
电流 - 输出: 1.2A
电压 - 负载: 6 V ~ 30 V
电源电压: 6 V ~ 30 V
安装类型: 表面贴装
封装/外壳: 52-VFQFN 裸露焊盘
供应商设备封装: 52-QFN(8x8)
包装: 散装
AMIS ? 30523
Table 3. THERMAL RESISTANCE
Thermal Resistance
Junction ? to ? Exposed Pad
Junction ? to ? Ambient (Rth J ? A )
Package
QFN ? 52
(Rth J ? EP )
0.95
1S0P Board
60
2S2P Board
30
Unit
K/W
EQUIVALENT SCHEMATICS
Following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified
representations of the circuits used.
IN
4k
Rpd
TYPE 1: CLR Input
TYPE 4: DO and ERR Open
Drain Outputs
OUT
IN
VDD
4k
TYPE 2: CLK, DI, CS, NXT, DIR Inputs
VDD
VBB
VBB
R out
TYPE 5: SLA Analog Output
SLA
TYPE 3: V DD and V BB Power Supply
Figure 3. In ? and Output Equivalent Diagrams
PACKAGE THERMAL CHARACTERISTICS
The AMIS ? 30523 is available in a QFN ? 52 package. For
cooling optimizations, the QFN has an exposed thermal pad
which has to be soldered to the PCB ground plane. The
ground plane needs thermal vias to conduct the heat to the
bottom layer. Figure 4 gives an example for good power
distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the device are given. The thermal
media to which the power of the devices has to be given are:
? Static environmental air (via the case)
? PCB board copper area (via the exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters Motor Driver.
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rth J ? A ) and the overall Rth
from the junction to exposed pad (Rth J ? EP ). In Table 3 one
can find the values for the Rth J ? A and Rth J ? EP , simulated
according to JESD ? 51:
The Rth J ? A for 2S2P is simulated conform JEDEC
JESD ? 51 as follows:
? A 4 ? layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
? Board thickness is 1.46 mm (FR4 PCB material)
? The 2 signal layers: 70 m m thick copper with an area of
5500 mm 2 copper and 20% conductivity
http://onsemi.com
5
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