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参数资料
| 型号： | AMMC-2008 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 开关 |
| 英文描述： | 0 MHz - 50000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 2.3 dB INSERTION LOSS |
| 封装： | 0.0366 X 0.0248 INCH, DIE |
| 文件页数： | 6/7页 |
| 文件大小： | 130K |
| 代理商： | AMMC-2008 |
6
Figure 9. AMMC-2008 Schematic.
Operation
The RF Input and Output ports
may be DC or AC-coupled. If
DC-coupled, the voltages on the
Input and Output ports must be
0
± 0.25 volts for guaranteed
switch performance.
Assembly Techniques
The chip should be attached
directly to the ground plane
using either a fluxless AuSn
solder preform or electrically
conductive epoxy[1].For conduc-
tive epoxy, the amount should be
just enough to provide a thin
fillet around the bottom perim-
eter of the die. The ground plane
should be free of any residue that
may jeopardize electrical or
mechanical attachment. Caution
should be taken to not exceed the
Absolute Maximum Rating for
assembly temperature and time.
Thermosonic wedge bonding is
the preferred method for wire
attachment to the bond pads. The
RF connections should be kept as
short as possible to minimize
inductance. Gold mesh[2] or
double-bonding with 0.7 mil gold
wire is recommended.
Mesh can be attached using a
2 mil round tracking tool and a
tool force of approximately
22 grams with an ultrasonic
power of roughly 55 dB for a
duration of 76
± 8 mS. A guided
wedge at an ultrasonic power
level of 64 dB can be used for the
0.7 mil wire. The recommended
wire bond stage temperature is
150
± 2°C.
The chip is 100 mm thick and
should be handled with care.
This MMIC has exposed air
bridges on the top surface.
Handle at edges or with a custom
collet (do not pick up die with
vacuum on die center.)
Recommended Operation Conditions
Vsel1
Vsel2
RF Out1
RF Out2
0.6>0> -0.4
-3.5 > -3 > -2.5
ON
OFF
-3.5 > -3 > -2.5
0.6>0> -0.4
OFF
ON
0.6>0> -0.4
OFF
-3.5 > -3 > -2.5
OFF
Figure 10. Biasing Diagram.
RF
Output 1
RF
Input
RF
Output 2
Vsel 2
Vsel 1
RF Input
RF Output 1
RF Output 2
Vsel 1
Vsel 2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMC-2008-W10 | 功能描述:RF 开关 IC Switch GaAs SPDT RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel |
| AMMC-2008-W50 | 功能描述:RF 开关 IC Switch GaAs SPDT RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel |
| AMMC-3040 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:18-36 GHz Double-Balanced Mixer with Integrated LO Amplifier/Multiplier |
| AMMC-3040-W10 | 功能描述:上下转换器 IC Mixer LO Amp RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| AMMC-3040-W50 | 功能描述:上下转换器 IC Mixer LO Amp RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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