- 您现在的位置：买卖IC网 > PDF目录64112 > AMMC-6530-W10 (AGILENT TECHNOLOGIES INC) 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 8 dB CONVERSION LOSS-MAX PDF资料下载
参数资料
| 型号： | AMMC-6530-W10 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 混频器 |
| 英文描述： | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 8 dB CONVERSION LOSS-MAX |
| 封装： | 1.30 X 1.40 MM, DIE |
| 文件页数： | 8/8页 |
| 文件大小： | 262K |
| 代理商： | AMMC-6530-W10 |
Assembly Techniques
The backside of the MMIC chip is
RF ground. For microstrip
applications the chip should be
attached directly to the ground
plane (e.g. circuit carrier or
heatsink) using electrically
conductive epoxy[1].
For best performance, the topside
of the MMIC should be brought
up to the same height as the
circuit surrounding it. This can
be accomplished by mounting a
gold plate metal shim (same
length and width as the MMIC)
under the chip which is of correct
thickness to make the chip and
adjacent circuit the same height.
The amount of epoxy used for the
chip and/or shim attachment
should be just enough to provide
a thin fillet around the bottom
perimeter of the chip or shim.
The ground plane should be free
of any residue that may jeopar-
dize electrical or mechanical
attachment.
The location of the RF bond pads
is shown in Figure 23. Note that
all the RF input and output ports
are in a Ground-Signal-Ground
configuration.
RF connections should be kept as
short as reasonable to minimize
performance degradation due to
undesirable series inductance. A
single bond wire is normally
sufficient for signal connections,
however double bonding with
0.7 mil gold wire or use of gold
mesh[2] is recommended for best
performance, especially near the
high end of the frequency band.
Thermosonic wedge bonding is
the preferred method for wire
attachment to the bond pads.
Gold mesh can be attached using
a 2 mil round tracking tool and a
tool force of approximately
22 grams and a ultrasonic power
of roughly 55 dB for a duration of
76
±8 mS. The guided wedge at an
untrasonic power level of 64 dB
can be used for 0.7 mil wire. The
recommended wire bond stage
temperature is 150
±2°C.
Caution should be taken to not
exceed the Absolute Maximum
Rating for assembly temperature
and time.
The chip is 100
m thick and
should be handled with care.
This MMIC has exposed air
bridges on the top surface and
should be handled by the edges
or with a custom collet (do not
pick up the die with a vacuum on
die center).
This MMIC is also static sensitive
and ESD precautions should be
taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is
recommended.
2. Buckbee-Mears Corporation, St.
Paul, MN, 800-262-3824
RF/LO
LO/RF
Vg
Gnd
IF1
IF2
Figure 23. AMMC-6530 Assembly Diagram.
Part Number Ordering Information
Devices
Part Number
per Container
AMMC-6530-W10
10
AMMC-6530-W50
50
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright 2005 Agilent Technologies, Inc.
Obsoletes 5989-3670EN
September 2
1, 2005
5989-3945EN
相关PDF资料 |
PDF描述 |
|---|---|
| AMMP-5618-BLK | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6231-BLKG | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6231-TR2G | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMC-6530-W50 | 功能描述:射频混合器 Mixer MMIC 6-30GHz RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| AMMC-6545 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:18 to 45 GHz Sub - Harmonic Mixer LO Frequency: 9-24GHz |
| AMMC-6545-W10 | 功能描述:射频混合器 Mixer 18-33GHz RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| AMMC-6545-W50 | 功能描述:射频混合器 Mixer 18-33GHz RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| AMMC-6550-W10 | 功能描述:上下转换器 Image Rejection Mixr 15-50GHz RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
发布紧急采购，3分钟左右您将得到回复。