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| 型号： | AMMC-6640 |
| 元件分类： | 衰减器 |
| 英文描述： | 0 MHz - 50000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
| 封装： | ROHS COMPLIANT, PLASTIC PACKAGE-4 |
| 文件页数： | 2/11页 |
| 文件大小： | 394K |
| 代理商： | AMMC-6640 |
10
AMMC-6640 Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to the
ground plane (e.g. circuit carrier or heatsink) using electri-
cally conductive epoxy [1].
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length as the MMIC) under the chip
which is of correct thickness to make the chip and adjacent
circuit the same height. The amount of epoxy used for the
chip or shim attachment should be just enough to provide
a thin llet around the bottom perimeter of the chip.
The ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment.
RF connections should be kept as short as reasonable
to minimize performance degradation due to undesir-
able series inductance. A single bond wire is normally
Figure 20. AMMC-6640 Bond Pad Locations
Figure 21. AMMC-6630 Assembly Diagram
sucient for signal connections, however double bonding
with 0.7mil gold wire will reduce series inductance. Gold
thermo-sonic wedge bonding is the preferred method for
wire attachment to the bond pads. The recommended
wire bond stage temperature is 150°C+/-2°C. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
The chip is 100
Pm thick and should be handled with care.
Even though this MMIC has 4550 Angstroms of silicon
nitride covering the air bridges on the top surface of the
die, it should be handled by the edges or with a custom
collet (do not pick up the die with a vacuum on die center).
Bonding pads and chip backside metallization are gold.
This MMIC is static sensitive and ESD precautions should be taken.
Please see page 1 for ESD rating levels.
Notes:
1. Sumitomo 1295SA silver epoxy is recommended.
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相关代理商/技术参数 |
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| AMMC-6640-W10 | 功能描述:有源衰减器 Attenuator Chip DC-40GHz RoHS:否 制造商:TriQuint Semiconductor 通道数量: 最大频率: 阻抗: 最大 VSWR: 位数: 最大工作温度: 最小工作温度: |
| AMMC-6640-W50 | 功能描述:有源衰减器 Attenuator Chip DC-40GHz RoHS:否 制造商:TriQuint Semiconductor 通道数量: 最大频率: 阻抗: 最大 VSWR: 位数: 最大工作温度: 最小工作温度: |
| AMMC-6650-W10 | 功能描述:有源衰减器 Attenuator DC-45GHz RoHS:否 制造商:TriQuint Semiconductor 通道数量: 最大频率: 阻抗: 最大 VSWR: 位数: 最大工作温度: 最小工作温度: |
| AMMC-6650-W50 | 功能描述:有源衰减器 Attenuator DC-45GHz RoHS:否 制造商:TriQuint Semiconductor 通道数量: 最大频率: 阻抗: 最大 VSWR: 位数: 最大工作温度: 最小工作温度: |
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