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参数资料
| 型号： | AMMP-5618-BLK |
| 元件分类： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 5 X 5 MM, SURFACE MOUNT PACKAGE-8 |
| 文件页数： | 8/9页 |
| 文件大小： | 342K |
| 代理商： | AMMP-5618-BLK |
8
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
Figure 25. Stencil Outline Drawing (mm).
Figure 26. Combined PCB and Stencil Layouts (mm).
Solder Reflow Profile
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 24. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 25. The stencil has a solder paste deposi-
tion opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
0.7
7
0.5
2
0.39
0.72
0.56
0.36
0.1
5
0.5
5
0.1
1.04
1.4
7
0.3
0.38
0.2
5
2.49
2.7
9
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Te
m
p
(°
C)
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
Peak = 250 ±5°C
Melting point = 218°C
相关PDF资料 |
PDF描述 |
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| AMMP-5618-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6231-BLKG | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6231-TR2G | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6231 | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-5618-TR1 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5618-TR2 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620_13 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 a?? 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620-BLKG | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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