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参数资料
| 型号： | AMMP-5618 |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 5 X 5 MM, SURFACE MOUNT PACKAGE-8 |
| 文件页数： | 3/4页 |
| 文件大小： | 80K |
| 代理商： | AMMP-5618 |
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Agilent Technologies releases
this product for general sales, Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates,
and remove availability of the product(s) at anytime.
Revision Date: 5/6/04
Revision Number: 5.1
Outline Drawing
Suggested PCB Material and Land Pattern
Evaluation Test Circuit (Demo Board)
(Available to customer on qualified request)
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with
high volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is
strongly recommended. An electronic drawing of the
land pattern is available from www.agilent.com/view/rf
or upon request from Agilent Application Engineering.
Manual Assembly for Prototypes
1.
Follow ESD precautions while handling packages.
2.
Handling should be along the edges with tweezers
or from topside if using a vacuum collet.
3.
Recommended attachment is solder paste. Please
see recommended solder reflow profile.
Conductive epoxy is not recommended. Hand
soldering is not recommended.
4.
Apply solder paste using either a stencil printer or
dot placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent
mechanical and electrical performance.
Excessive solder will degrade RF performance.
5.
Follow solder paste and vendor’s
recommendations when developing a solder
reflow profile. A standard profile will have a
steady ramp up from room temperature to the pre-
heat temperature to avoid damage due to thermal
shock.
6.
Packages have been qualified to withstand a peak
temperature of 235
°C for 15 seconds. Verify that
the profile will not expose device beyond these
limits.
7.
Clean off flux per vendor’s recommendations.
8.
Clean the module with Acetone. Rinse with
alcohol. Allow the module to fully dry before
testing.
25
75
125
175
225
012
3456
78
TIME (minutes)
Tem
per
at
ur
e
(
°
C
)
Recommended solder reflow profile
For product information and a complete list of Agilent
contacts and distributors, please go to our website:
NOTES:
1.
INIDICATES PIN 1
2.
DIMENSIONS ARE IN
INCHES [MILIMETERS]
3.
ALL GROUNDS MUST
BE SOLDERED TO PCB
RF GROUND
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-5618_13 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6a??20 GHz General Purpose Amplifier |
| AMMP-5618-BLK | 功能描述:射频放大器 6-20 GHz 13 dB RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5618-TR1 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5618-TR2 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
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