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参数资料
| 型号： | AMMP-6220-BLK |
| 元件分类： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 5 X 5 MM, SMT, 8 PIN |
| 文件页数： | 10/10页 |
| 文件大小： | 427K |
| 代理商： | AMMP-6220-BLK |
9
Solder Reflow Profile
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 26. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 26 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Figure 26. Suggested lead-free reflow profile for SnAgCu solder paste.
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommendedattachmentisconductivesolderpaste.
Please see recommended solder reflow profile. Con-
ductive epoxy is not recommended. Hand soldering
is not recommended.
4. Apply solder paste using a stencil printer or dot place-
ment. Thevolumeofsolderpastewillbedependenton
PCB and component layout and should be controlled
to ensure consistent mechanical and electrical perfor-
mance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
AMMP-6220 Part Number Ordering Information
Part Number
Devices Per Container
Container
AMMP-6220-BLK
10
Antistatic bag
AMMP-6220-TR1
100
7”Reel
AMMP-6220-TR2
500
7”Reel
TIME (SECONDS)
300
250
200
150
100
50
0
50
100
150
200
250
300
0
TEMPERA
TURE
(C)
PEAK = 250 ± 5 C
MELTING POINT = 218 C
RAMP 1
RAMP 2
REFLOW
COOLING
PREHEAT
相关PDF资料 |
PDF描述 |
|---|---|
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6233-BLKG | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6233-TR1G | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6345-BLKG | 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-6220-TR1 | 功能描述:射频放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6220-TR2 | 功能描述:射频放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6222 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:7 to 21 GHz GaAs High Linearity LNA in SMT Package |
| AMMP-6222-BLKG | 功能描述:射频放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6222-TR1G | 功能描述:射频放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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