参数资料
型号: AMMP-6222-TR2G
元件分类: 放大器
英文描述: 7000 MHz - 21000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封装: 5 X 5 MM, 1.25 MM HEIGHT, LEAD FREE, SMT, 8 PIN
文件页数: 3/12页
文件大小: 365K
代理商: AMMP-6222-TR2G
11
Figure 24. Suggested Lead-Free Reow Prole for SnAgCu Solder Paste
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Neither
Conductive epoxy or hand soldering is recommended.
x Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
x Packages have been qualied to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
prole will not expose device beyond these limits.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(
C)
Peak = 250 ± 5C
Ramp 1
Preheat Ramp 2
Reflow
Cooling
Melting point = 218C
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads. The recommended stencil layout is shown
in Figure 23. The stencil has a solder paste deposition
opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The most commonly used solder reow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reow prole for automated reow
processes is shown in Figure 24. This prole is designed
to ensure reliable nished joints. However, the prole
indicated in Figure 14 will vary among dierent solder
pastes from dierent manufacturers and is shown here for
reference only.
Package, Tape & Reel, and Ordering Information
AMMP-6222 Part Number Ordering Information
Part Number
Devices Per Container
Container
AMMP-6222-BLKG
10
Antistatic bag
AMMP-6222-TR1G
100
7”Reel
AMMP-6222-TR2G
500
7”Reel
相关PDF资料
PDF描述
AMMP-6222-TR1G 7000 MHz - 21000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6408-TR2G 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6408-TR1G 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6408-BLKG 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6425 18000 MHz - 28000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
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