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参数资料
| 型号： | AMMP-6233-TR1G |
| 元件分类： | 放大器 |
| 英文描述： | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 5 X 5 MM, 1.25 MM HEIGHT, SMT, 8 PIN |
| 文件页数： | 7/8页 |
| 文件大小： | 616K |
| 代理商： | AMMP-6233-TR1G |
Package, Tape & Reel, and Ordering Information
Back View
.011
Manual Assembly
FollowESDprecautionswhilehandlingpackages.
Handlingshouldbealongtheedgeswithtweezers.
Recommended attachment is conductive solder
paste.Pleaseseerecommendedsolderreflowprofile.
NeitherConductiveepoxyorhandsolderingisrecom-
mended.
Applysolderpasteusingastencilprinterordotplace-
ment.Thevolumeofsolderpastewillbedependenton
PCBandcomponentlayoutandshouldbecontrolled
toensureconsistentmechanicalandelectricalperfor-
mance.
Followsolderpasteandvendor’srecommendations
whendevelopingasolderreflowprofile.Astandard
profile will have a steady ramp up from room tem-
peraturetothepre-heattemp.toavoiddamagedue
tothermalshock.
Packages have been qualified to withstand a peak
temperatureof260°Cfor20seconds.Verifythatthe
profilewillnotexposedevicebeyondtheselimits.
Aproperlydesignedsolderscreenorstencilisrequired
toensureoptimumamountofsolderpasteisdeposited
ontothePCBpads.Therecommendedstencillayoutis
showninFigure16.Thestencilhasasolderpastede-
positionopeningapproximately70%to90%ofthePCB
pad. Reducing stencil opening can potentially gener-
atemorevoidsunderneath.Ontheotherhand,stencil
openingslargerthan100%willleadtoexcessivesolder
pastesmearorbridgingacrosstheI/Opads.Considering
thefactthatsolderpastethicknesswilldirectlyaffectthe
qualityofthesolderjoint,agoodchoiceistousealaser
cutstencilcomposedof0.127mm(5mils)thickstainless
steel which is capable of producing the required fine
stenciloutline.
Themostcommonlyusedsolderreflowmethodisac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 17. This profile is
designed to ensure reliable finished joints. However,
theprofileindicatedinFigure1willvaryamongdifferent
solderpastesfromdifferentmanufacturersandisshown
hereforreferenceonly.
Figure 17. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp(C)
Peak=250±5C
Ramp1
Preheat Ramp2 Reflow
Cooling
Meltingpoint=218C
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| AMMP-6345-TR2G | 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6420 | 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-6233-TR2G | 功能描述:射频放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6333 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:18 a?? 33 GHz, 0.2 W Driver Amplifier in SMT Package |
| AMMP-6333-BLKG | 功能描述:射频放大器 Dvr Amp 17-33GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6333-TR1G | 功能描述:射频放大器 Dvr Amp 17-33GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6333-TR2G | 功能描述:射频放大器 Dvr Amp 17-33GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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