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参数资料
| 型号： | AMMP-6421-TR2G |
| 元件分类： | 放大器 |
| 英文描述： | 13000 MHz - 16000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 5 X 5 MM, SMT-8 |
| 文件页数： | 3/12页 |
| 文件大小： | 257K |
| 代理商： | AMMP-6421-TR2G |
11
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Neither
Conductive epoxy or hand soldering is recommended.
x Apply solder paste using a stencil printer or dot place-
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room temper-
ature to the pre-heat temp. to avoid damage due to
thermal shock.
x Packages have been qualied to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
prole will not expose device beyond these limits.
Figure 19. Suggested Lead-Free Reow Prole for SnAgCu Solder Paste
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Te
m
p
(C
)
Peak = 250 ± 5°C
Ramp 1 Preheat
Ramp 2
Reow
Cooling
Melting point = 218°C
AMMP-64xx Part Number Ordering Information
Part Number
Devices Per
Container
AMMP-6421-BLKG
10
Antistatic bag
AMMP-6421-TR1G
100
7” Reel
AMMP-6421-TR2G
500
7” Reel
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 18b. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The most commonly used solder reow method is accom-
plished in a belt furnace using convection heat transfer.The
suggested reow prole for automated reow processes is
showninFigure19.Thisproleisdesignedtoensurereliable
nished joints. However, the prole indicated in Figure 1
will vary among dierent solder pastes from dierent
manufacturers and is shown here for reference only.
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PDF描述 |
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| AMMP-6425-BLKG | 18000 MHz - 28000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6425-TR1G | 18000 MHz - 28000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6425-TR2G | 18000 MHz - 28000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMP-6630-BLKG | 5000 MHz - 30000 MHz RF/MICROWAVE VARIABLE ATTENUATOR |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-6425 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:18-28 GHz 1W Power Amplifier in SMT Package |
| AMMP-6425_13 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:18-28 GHz 1W Power Amplifier in SMT Package |
| AMMP-6425-BLK | 制造商:Avago Technologies 功能描述:17.7-27GHZ 1W POWER AMP, MMIC - Bulk |
| AMMP-6425-BLKG | 功能描述:射频放大器 18-28 GHz Power Amp RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6425-TR1 | 制造商:Avago Technologies 功能描述: |
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