参数资料
型号: AMP02FP
厂商: Analog Devices Inc
文件页数: 6/12页
文件大小: 0K
描述: IC AMP INST PREC LDRIFT 8DIP
标准包装: 50
放大器类型: 仪表
电路数: 1
转换速率: 6 V/µs
-3db带宽: 1.2MHz
电流 - 输入偏压: 4nA
电压 - 输入偏移: 40µV
电流 - 电源: 5mA
电流 - 输出 / 通道: 32mA
电压 - 电源,单路/双路(±): ±4.5 V ~ 18 V
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-PDIP
包装: 管件
REV. E
AMP02
–3–
AMP02E
AMP02F
Parameter
Symbol
Conditions
Min
Typ
Max
Min
Typ
Max
Unit
POWER SUPPLY
Supply Voltage Range
VS
±4.5
±18
±4.5
±18
V
Supply Current
ISY
TA = 25
°C5
6
5
6
mA
–40
°C ≤ TA ≤ +85°C5
6
5
6
mA
NOTES
1Input voltage range guaranteed by common-mode rejection test.
2Guaranteed by design.
3Gain tempco does not include the effects of external component drift.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
1, 2
Supply Voltage
±18 V
Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V]
Differential Input Voltage
[(V–) – 60 V] to [(V+) + 60 V]
Output Short-Circuit Duration
Continuous
Operating Temperature Range
–40
°C to +85°C
Storage Temperature Range
–65
°C to +150°C
Function Temperature Range
–65
°C to +150°C
Lead Temperature (Soldering, 10 sec)
300
°C
Package Type
JA
3
JC
Unit
8-Lead Plastic DIP (P)
96
37
°C/W
16-Lead SOIC (S)
92
27
°C/W
–IN
+IN
RG1 RG2
25k
V+
SENSE
OUT
REFERENCE
V–
Figure 2. Simplified Schematic
ORDERING GUIDE
VIOS max @ VOOS max @ Temperature
Package
Model
TA = 25 CTA = 25 C
Range
Description
AMP02EP
100
V4 mV
–40
°C to +85°C
8-Lead Plastic DIP
AMP02FP
200
V8 mV
–40
°C to +85°C
8-Lead Plastic DIP
AMP02AZ/883C
200
V
10 mV
–55
°C to +125°C 8-Lead CERDIP
AMP02FS
200
V8 mV
–40
°C to +85°C
16-Lead SOIC
AMP02GBC
Die
AMP02FS-REEL
200
V8 mV
–40
°C to +85°C
16-Lead SOIC
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
3
θ
JA is specified for worst case mounting conditions, i.e.,
θ
JA is specified for
device in socket for P-DIP package;
θ
JA is specified for device soldered to
printed circuit board for SOIC package.
相关PDF资料
PDF描述
RJS 4 FUSE 4A 600V GLASS STD RJS
RJS 3 FUSE 3A 600V GLASS STD RJS
RJS 300SHORT FUSE 300MA 600V GLASS SHORT RJS
RJS 250SHORT FUSE 250MA 600V GLASS SHORT RJS
P4KE30A-G TVS 400W 30V 5% UNIDIR DO-41
相关代理商/技术参数
参数描述
AMP02FPZ 功能描述:IC AMP INST PREC LDRIFT 8DIP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:- 放大器类型:通用 电路数:4 输出类型:- 转换速率:0.6 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:45nA 电压 - 输入偏移:2000µV 电流 - 电源:1.4mA 电流 - 输出 / 通道:40mA 电压 - 电源,单路/双路(±):3 V ~ 32 V,±1.5 V ~ 16 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR) 其它名称:LM324ADTBR2G-NDLM324ADTBR2GOSTR
AMP02FS 功能描述:IC AMP INST PREC LDRIFT 16SOIC RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:Excalibur™ 放大器类型:J-FET 电路数:1 输出类型:- 转换速率:45 V/µs 增益带宽积:10MHz -3db带宽:- 电流 - 输入偏压:20pA 电压 - 输入偏移:490µV 电流 - 电源:1.7mA 电流 - 输出 / 通道:48mA 电压 - 电源,单路/双路(±):4.5 V ~ 38 V,±2.25 V ~ 19 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
AMP02FSREEL 制造商:AD 功能描述:NEW
AMP02FS-REEL 功能描述:IC AMP INST PREC LDRIFT 16SOIC RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:Excalibur™ 放大器类型:J-FET 电路数:1 输出类型:- 转换速率:45 V/µs 增益带宽积:10MHz -3db带宽:- 电流 - 输入偏压:20pA 电压 - 输入偏移:490µV 电流 - 电源:1.7mA 电流 - 输出 / 通道:48mA 电压 - 电源,单路/双路(±):4.5 V ~ 38 V,±2.25 V ~ 19 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
AMP02FSZ 功能描述:IC AMP INST PREC LDRIFT 16SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:- 放大器类型:通用 电路数:4 输出类型:- 转换速率:0.6 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:45nA 电压 - 输入偏移:2000µV 电流 - 电源:1.4mA 电流 - 输出 / 通道:40mA 电压 - 电源,单路/双路(±):3 V ~ 32 V,±1.5 V ~ 16 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 供应商设备封装:14-TSSOP 包装:带卷 (TR) 其它名称:LM324ADTBR2G-NDLM324ADTBR2GOSTR