参数资料
| 型号： | AMP02FSZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | IC AMP INST PREC LDRIFT 16SOIC |
| 标准包装： | 1,000 |
| 放大器类型： | 仪表 |
| 电路数： | 1 |
| 转换速率： | 6 V/µs |
| -3db带宽： | 1.2MHz |
| 电流 - 输入偏压： | 4nA |
| 电压 - 输入偏移： | 40µV |
| 电流 - 电源： | 5mA |
| 电流 - 输出 / 通道： | 32mA |
| 电压 - 电源，单路/双路(±)： | ±4.5 V ~ 18 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC W |
| 包装： | 带卷 (TR) |
REV. E
AMP02
–3–
AMP02E
AMP02F
Parameter
Symbol
Conditions
Min
Typ
Max
Min
Typ
Max
Unit
POWER SUPPLY
Supply Voltage Range
VS
±4.5
±18
±4.5
±18
V
Supply Current
ISY
TA = 25
°C5
6
5
6
mA
–40
°C ≤ TA ≤ +85°C5
6
5
6
mA
NOTES
1Input voltage range guaranteed by common-mode rejection test.
2Guaranteed by design.
3Gain tempco does not include the effects of external component drift.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
1, 2
Supply Voltage
±18 V
Common-Mode Input Voltage [(V–) – 60 V] to [(V+) + 60 V]
Differential Input Voltage
[(V–) – 60 V] to [(V+) + 60 V]
Output Short-Circuit Duration
Continuous
Operating Temperature Range
–40
°C to +85°C
Storage Temperature Range
–65
°C to +150°C
Function Temperature Range
–65
°C to +150°C
Lead Temperature (Soldering, 10 sec)
300
°C
Package Type
JA
3
JC
Unit
8-Lead Plastic DIP (P)
96
37
°C/W
16-Lead SOIC (S)
92
27
°C/W
–IN
+IN
RG1 RG2
25k
V+
SENSE
OUT
REFERENCE
V–
Figure 2. Simplified Schematic
ORDERING GUIDE
VIOS max @ VOOS max @ Temperature
Package
Model
TA = 25 CTA = 25 C
Range
Description
AMP02EP
100
V4 mV
–40
°C to +85°C
8-Lead Plastic DIP
AMP02FP
200
V8 mV
–40
°C to +85°C
8-Lead Plastic DIP
AMP02AZ/883C
200
V
10 mV
–55
°C to +125°C 8-Lead CERDIP
AMP02FS
200
V8 mV
–40
°C to +85°C
16-Lead SOIC
AMP02GBC
Die
AMP02FS-REEL
200
V8 mV
–40
°C to +85°C
16-Lead SOIC
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
3
θ
JA is specified for worst case mounting conditions, i.e.,
θ
JA is specified for
device in socket for P-DIP package;
θ
JA is specified for device soldered to
printed circuit board for SOIC package.
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