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参数资料
| 型号： | AP1501A-50K5L-U |
| 厂商： | Diodes Inc |
| 文件页数： | 10/14页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK 5V 5A TO263-5 |
| 标准包装： | 50 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 4.5 V ~ 40 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 150kHz |
| 电流 - 输出： | 5A |
| 同步整流器： | 无 |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-6，D²Pak（5 引线+接片），TO-263BA |
| 包装： | 管件 |
| 供应商设备封装： | TO-263-5 |
AP1501A
150KHz, 5A PWM BUCK DC/DC CONVERTER
Functional Description
an ambient temperature of 25 C (still air). These temperature rise
the package is soldered to should be at least 0.8 in , and ideally should
approximately 6 in , only small improvements in heat dissipation are
Pin Functions
+V IN
This is the positive input supply for the IC switching regulator. A suitable
input bypass capacitor must be present at this pin to minimize voltage
transients and to supply the switching currents needed by the regulator.
Ground
Circuit ground.
Output
Internal switch. The voltage at this pin switches between (+V IN – V SAT )
and approximately – 0.5V, with a duty cycle of approximately
V OUT / V IN . To minimize coupling to sensitive circuitry, the PC board
copper area connected to this pin should be kept a minimum.
Feedback
Senses the regulated output voltage to complete the feedback loop.
ON/OFF
Allows the switching regulator circuit to be shutdown using logic level
signals thus dropping the total input supply current to approximately
150uA. Pulling this pin below a threshold voltage of approximately
1.3V turns the regulator on, and pulling this pin above 1.3V (up to a
maximum of 40V) shuts the regulator down. If this shutdown feature is
not needed, the ON/OFF pin can be wired to the ground pin or it can be
left open, in either case the regulator will be in the ON condition.
Thermal Considerations
The AP1501A is available in two packages, a 5-pin surface mount
TO-263 and TO-220.
The TO-220 package needs a heat sink under most conditions. The size
of the heat sink depends on the input voltage, the output voltage, the
load current and the ambient temperature. The AP1501A junction
temperature rises above ambient temperature for a 5A load and different
input and output voltages. The data for these curves was taken with the
AP1501A (TO-220 package) operating as a buck switching regulator in
o
numbers are all approximate and there are many factors that can affect
these temperatures. Higher ambient temperatures require more heat
sinking.
The TO-263 surface mount package tab is designed to be soldered to
the copper on a printed circuit board. The copper and the board are the
heat sink for this package and the other heat producing components,
such as the catch diode and inductor. The PC board copper area that
2
have 2 or more square inches of 2 oz. Additional copper area improves
the thermal characteristics, but with copper areas greater than
2
realized. If further thermal improvements are needed, double sided,
multilayer PC boards with large copper areas and/or airflow are
recommended.
The AP1501A (TO-263 package) junction temperature rise above
ambient temperature with a 2A load for various input and output voltages.
This data was taken with the circuit operating as a buck switching
regulator with all components mounted on a PC board to simulate the
junction temperature under actual operating conditions. This curve can
be used for a quick check for the approximate junction temperature for
various conditions, but be aware that there are many factors that can
affect the junction temperature. When load currents higher than 3A are
used, double sided or multilayer PC boards with large copper areas
and/or airflow might be needed, especially for high ambient temperatures
and high output voltages.
For the best thermal performance, wide copper traces and generous
amounts of printed circuit board copper should be used in the board
layout. (Once exception to this is the output (switch) pin, which should not
have large areas of copper.) Large areas of copper provide the best
transfer of heat (lower thermal resistance) to the surrounding air, and
moving air lowers the thermal resistance even further.
Package thermal resistance and junction temperature rise numbers are
all approximate, and there are many factors that will affect these
numbers. Some of these factors include board size, shape, thickness,
position, location, and even board temperature. Other factors are, trace
width, total printed circuit copper area, copper thickness, single or
double-sided, multilayer board and the amount of solder on the board.
The effectiveness of the PC board to dissipate heat also depends on the
size, quantity and spacing of other components on the board, as well as
whether the surrounding air is still or moving.
Furthermore, some of these components such as the catch diode will
add heat to the PC board and the heat can vary as the input voltage
changes. For the inductor, depending on the physical size, type of core
material and the DC resistance, it could either act as a heat sink taking
heat away from the board, or it could add heat to the board.
AP1501A Rev. 10
DS31191
10 of 14
SEPTEMBER 2009
? Diodes Incorporated
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