参数资料
型号: AP8800FNG-7
厂商: Diodes Inc
文件页数: 3/13页
文件大小: 0K
描述: IC LED DRIVER HIGH BRIGHT 10DFN
特色产品: LED Driver Solutions
AP880X Series Step-Down DC/DC Converter
标准包装: 1
恒定电流:
拓扑: PWM,降压(降压)
输出数: 1
内部驱动器:
类型 - 主要: 背光
类型 - 次要: 高亮度 LED(HBLED)
频率: 600kHz
电源电压: 8 V ~ 28 V
输出电压: 28V
安装类型: 表面贴装
封装/外壳: 10-UFDFN 裸露焊盘
供应商设备封装: DFN3030-10
包装: 标准包装
工作温度: -40°C ~ 85°C
产品目录页面: 1138 (CN2011-ZH PDF)
其它名称: AP8800FNGDIDKR
AP8800
Recommended Operating Conditions (@T A = +25°C, unless otherwise specified.)
Symbol
V IN
V CTRLDC
V CTRLL
f OSC
T A
Duty Cycle
V ENH
V ENL
Parameter
Operating Input Voltage relative to GND
Voltage Range for 24% to 200% DC Dimming Relative to GND (Note 2)
Voltage Low for PWM Dimming Relative to GND
Maximum Switching Frequency
Ambient Temperature Range
Using Inductor ≥ 100μH (Note 3)
CTRL Input Voltage to Attain 100% LED Current
CTRL Input Voltage Below Which Device Turns Off
Min
8.0
0.3
0
-40
0.1
1.25
Max
28
2.5
0.2
500
+85
0.95
0.2
Unit
V
V
V
kHz
°C
V
Notes:
2.
3.
For 100% brightness either leave floating or connect to 1.25V relative to GND.
For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on propagation
delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is most noticeable at low
duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.
Electrical Characteristics (@T A = +25°C, unless otherwise specified.)
Symbol
I OUT
I Q
V THD
V REF
SET
R DS (on)
I SW_Leakage
θ JA
θ JC
Parameter
Continuous Switch Current
Quiescient Current
Internal Current Sense Threshold Voltage
Internal Reference Voltage
SET Pin Input Current
On-Resistance of Internal Switch
Switch Pin Leakage Current
Thermal Resistance Junction-to-Ambient
Thermal Resistance Junction-to-Case
Conditions
(Note 4)
V IN – V SET
V SET = V IN -0.1
SO-8 (Note 5)
MSOP-8 (Note 5)
U-DFN3030-10 (Note 5)
SO-8 (Note 5)
MSOP-8 (Note 5)
U-DFN3030-10 (Note 5)
Min
92
Typ
20
100
1.25
1.3
1.7
92
120
46
60
98
32
Max
350
30
108
2.2
5
Unit
mA
μ A
mV
V
μ A
?
μ A
° C/W
° C/W
° C/W
° C/W
° C/W
° C/W
Notes:
4. Refer to figure 8 for the device derating curve.
5. Test condition for SO-8, MSOP-8 and U-DFN3030-10: Device mounted on FR-4 PCB, 2”x 2”, 2oz copper, minimum recommended pad layout on
top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
AP8800
Document number: DS31764 Rev. 7 - 2
3 of 13
www.diodes.com
August 2012
? Diodes Incorporated
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