参数资料
型号: AP8801SG-13
厂商: Diodes Inc
文件页数: 3/14页
文件大小: 0K
描述: IC LED DRIVER HIGH BRIGHT 8SOIC
特色产品: LED Driver Solutions
AP880X Series Step-Down DC/DC Converter
标准包装: 1
恒定电流:
拓扑: PWM,降压(降压)
输出数: 1
内部驱动器:
类型 - 主要: 背光
类型 - 次要: 高亮度 LED(HBLED)
频率: 500kHz
电源电压: 8 V ~ 48 V
输出电压: 48V
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOP
包装: 标准包装
工作温度: -40°C ~ 105°C
产品目录页面: 1138 (CN2011-ZH PDF)
其它名称: AP8801SGDIDKR
AP8801
500mA LED STEP-DOWN CONVERTER
Recommended Operating Conditions
Symbol
V IN
V CTRLDC
V CTRLL
f OSC
T A
Duty Cycle
Parameter
Operating Input Voltage relative to GND
Voltage range for 24% to 200% DC dimming relative to GND (Note 4)
Voltage Low for PWM dimming relative to GND
Maximum Switching Frequency (Note 5)
Ambient Temperature Range
Using Inductor ≥ 100μH (Note 6)
Min
8.0
0.3
0
-40
0.10
Max
48.0
2.5
0.2
625
+105
0.95
Unit
V
V
V
kHz
oC
Notes:
4. For 100% brightness either leave floating or connect to 1.25V relative to GND.
5. AP8801 will operate at higher frequencies but accuracy will be affected due to propagation delays.
6. For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on
propagation delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is most
noticeable at low duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.
Electrical Characteristics (T A = 25 ° C, V IN = 24V; unless otherwise specified.)
Symbol
I OUT
I Q
V THD
V SENSEHYS
V REF
SET
R DS(ON)
I SW_LEAKAGE
θ JA
θ JC
Parameter
Continuous switch current
Quiescent Current
Internal Threshold Voltage
Sense threshold hysteresis
Internal Reference Voltage
SET pin input current
On Resistance of MOSFET
Switch leakage current
Thermal Resistance Junction-to-Ambient
Thermal Resistance Junction-to-Case
Conditions
(Note 7)
V SET = V IN -0.2
I SW = 0.4A
SO-8 (Note 8)
MSOP-8 (Note 8)
SO-8 (Note 8)
MSOP-8 (Note 8)
Min
184
Typ
78
200
15
1.25
7
0.70
88
128
58
90
Max
500
120
216
1.15
8
Unit
mA
μ A
mV
%
V
μ A
?
μ A
° C/W
° C/W
° C/W
° C/W
Notes:
7. Refer to figure 6 for the device derating curve.
8. Test condition for SO-8 and MSOP-8: Device mounted on FR-4 PCB, 2”x2”, 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
AP8801
Document number: DS31765 Rev. 7 - 2
3 of 14
www.diodes.com
June 2012
? Diodes Incorporated
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