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参数资料
型号： APA600-FGG256I
厂商： Microsemi SoC
文件页数： 78/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 600K 256-FBGA
标准包装： 90
系列： ProASICPLUS
RAM 位总计： 129024
输入/输出数： 186
门数： 600000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 256-LBGA
供应商设备封装： 256-FPBGA（17x17）
ProASICPLUS Flash Family FPGAs
v5.9
4-1
Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Previous version
Changes in current version (v5.9)
Page
v5.8
(June 2009)
The –F speed grade is no longer supported and was removed from the datasheet.
N/A
A note regarding RoHS compliant packages was added to the "Device Resources" table.
iii
v5.7
(September 2008)
The "PLL Electrical Specifications" table was updated significantly. Changes were made to the
Input, VCO (Voltage Controlled Oscillator), and Output frequencies, and the acquisition time.
2-18
Table 2-10 PLL I/O Constraints is new.
2-19
Table 2-23 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V)
Applies to Commercial and Industrial Temperature Only is the same table that was in v5.7, but it
now only applies to commercial and industrial temperature ranges. Table 2-24 DC Electrical
Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V) Applies to Military Temperature
and MIL-STD-883B Temperature Only is based on Table 2-23 but Table 2-24 only applies to
military temperature. The VOH and VOL specifications were updated in Table 2-24, and changes
have been made to the drive currents at which 3.3 V VOH and VOL voltage levels are measured
and are now split by slew rate. In addition in Table 2-24, the maximum VIL specification has
changed from 0.8 V to 0.7 V for 3.3 V Schmitt-trigger input operation.
2-38
v5.6
(August 2008)
VOH and VOL data in Table 2-24 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD =
2.5 V ±0.2 V) Applies to Military Temperature and MIL-STD-883B Temperature Only was
changed back to the data in v5.5.
2-38
v5.5
(February 2007)
VOH and VOL data was updated in Table 2-24 DC Electrical Specifications (VDDP = 3.3 V ±0.3
V and VDD = 2.5 V ±0.2 V) Applies to Military Temperature and MIL-STD-883B Temperature
Only.
2-38
v5.4
(October 2006)
A statement about single cell and cascaded cell timing diagrams was added to the "Enclosed
Timing Diagrams – FIFO Mode:" section.
2-65
The following pins were updated in the "144-FBGA Pin" table:
Pin Number Updated Function
C2
I/O / GL1
F1
I/O / GL2
3-38
v5.3
The heading, MIL-STD-883B, and note 4 were added to the "Device Resources" table.
iii
(May 2006)
The "Temperature Grade Offerings" table was updated to include the military (M) temperature
grade in the following device/packages:
APA300-FG144
APA300-FG256
APA600-FG256
APA600-FG484
APA600-FG676
APA1000-FG896
iv
v5.2
90° and 270° phase shift support was removed from the datasheet.
N/A
(December 2005)
The "Ordering Information" section was updated to include RoHS information.
ii
The last paragraph of the "Boundary Scan (JTAG)" section was updated.
2-8
The Output Frequency Range in the "Timing Control and Characteristics" section.
2-10
The title for Table 2-19 Military Temperature Grade Product Performance Retention was
updated.
2-32
The caption was updated in Figure 2-45 FIFO Reset.
2-72
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相关代理商/技术参数
参数描述
APA600-FGG256M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 256-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 186 I/O 256FBGA
APA600-FGG484 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
APA600-FGG484A 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
APA600-FGG484I 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
APA600-FGG676 功能描述:IC FPGA PROASIC+ 600K 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
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