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参数资料
| 型号： | APM2055NVC-TR |
| 厂商： | Anpec Electronics Corporation |
| 元件分类： | 圆形连接器 |
| 英文描述： | Circular Connector; No. of Contacts:19; Series:MS27656; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No |
| 中文描述： | N沟道增强型MOS管 |
| 文件页数： | 8/10页 |
| 文件大小： | 149K |
| 代理商： | APM2055NVC-TR |
Copyright
ANPEC Electronics Corp.
Rev. A.1 - Feb., 2003
APM2055N
www.anpec.com.tw
8
Reference JEDEC Standard J-STD-020A APRIL 1999
Reflow Condition
(IR/Convection or VPR Reflow)
Physical S pecifications
Pre-heat temperature
183 C
Peak temperature
Time
t
Classification Reflow Profiles
Convection or IR/
Convection
3
°
C/second max.
120 seconds max
60 – 150 seconds
VPR
Average ramp-up rate(183
°
C to Peak)
Preheat temperature 125 ± 25
°
C)
Temperature maintained above 183
°
C
Time within 5
°
C of actual peak temperature 10 –20 seconds
Peak temperature range
Ramp-down rate
Time 25
°
C to peak temperature
10
°
C /second max.
60 seconds
215-219
°
C or 235 +5/-0
°
C
10
°
C /second max.
220 +5/-0
°
C or 235 +5/-0
°
C
6
°
C /second max.
6 minutes max.
Package Reflow Conditions
pkg. thickness
≥
2.5mm
and all bgas
Convection
220 +5/-0
°
C
VPR 215-219
°
C
IR/Convection 220 +5/-0
°
C
pkg. thickness < 2.5mm and
pkg. volume
≥
350 mm3
pkg. thickness < 2.5mm and pkg.
volume < 350mm3
Convection 235 +5/-0
°
C
VPR 235 +5/-0
°
C
IR/Convection 235 +5/-0
°
C
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
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