参数资料
型号: APR27-27-12CB/A01
厂商: CTS Thermal Management Products
文件页数: 1/3页
文件大小: 0K
描述: HEATSINK FORGED W/THERMAL TAPE
产品培训模块: FPGAs Spartan3
产品目录绘图: APR27-27 Series
标准包装: 75
系列: APR
类型: 顶部安装
冷却式包装: 分类(BGA,LGA,CPU,ASIC……)
固定方法: 散热带,粘合剂(含)
形状: 方形,鳍片
长度: 1.047"(26.60mm)
宽: 1.047"(26.60mm)
机座外的高度(散热片高度): 0.457"(11.60mm)
在强制气流下的热敏电阻: 在 200 LFM 时为5.3°C/W
材质:
材料表面处理: 黑色阳极化处理
产品目录页面: 2681 (CN2011-ZH PDF)
其它名称: 294-1126
Page 1 of 3
November 2004
IERC a CTS Company
413 North Moss Street
Burbank, CA 91502
818-842-7277
www.ctscorp.com
Series APR Forged Aluminum Heat Sinks with Pin Fins
Part Number
Fin Matrix
(Rows x Columns)
Length x Width x Height
(mm)
Thermal Resistance
(°C/Watt @ 200 LFPM)
Pressure Drop
(inches of water)
APR19-19-12CB
5 x 5
18.6 x 18.6 x 11.6
7.7
0.013
APR19-19-15CB
5 x 5
18.6 x 18.6 x 14.6
7.4
0.013
APR19-19-20CB
5 x 5
18.6 x 18.6 x 19.6
4.9
0.013
APR19-19-25CB
5 x 5
18.6 x 18.6 x 24.6
4.6
0.013
APR27-27-12CB
8 x 8
26.6 x 26.6 x 11.6
5.3
0.015
APR27-27-15CB
8 x 8
26.6 x 26.6 x 14.6
4.4
0.015
APR27-27-20CB
8 x 8
26.6 x 26.6 x 19.6
3.1
0.015
APR27-27-25CB
8 x 8
26.6 x 26.6 x 24.6
2.8
0.015
APR29-29-12CB
8 x 8
28.6 x 28.6 x 11.6
3.9
0.018
APR29-29-15CB
8 x 8
28.6 x 28.6 x 14.6
3.7
0.018
APR29-29-20CB
8 x 8
28.6 x 28.6 x 19.6
2.6
0.018
APR29-29-25CB
8 x 8
28.6 x 28.6 x 24.6
2.5
0.018
APR33-33-12CB
9 x 9
32.6 x 32.6 x 11.6
3.8
0.020
APR33-33-15CB
9 x 9
32.6 x 32.6 x 14.6
3.2
0.020
APR33-33-20CB
9 x 9
32.6 x 32.6 x 19.6
2.4
0.020
APR33-33-25CB
9 x 9
32.6 x 32.6 x 24.6
1.9
0.020
Material: 6063 Aluminum Alloy, Black Anodized
Features
Precision forging technology for high
power applications
Omni-directional pins
Designed for BGA and other surface
mount packages
Various mounting methods available
Select from multiple fin heights
Product Benefits
No special tools needed for assembly
No additional holes required on the PCB
Special clip easily snaps on and self-aligns
Series APR Forged Heat Sinks
Technical Data
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