参数资料
型号: APR3001-38B
厂商: Anpec Electronics Corporation
元件分类: 复位半导体
英文描述: MicroPower Microprocessor Reset Circuit
中文描述: 微功耗微处理器复位电路
文件页数: 13/15页
文件大小: 153K
代理商: APR3001-38B
Copyright
ANPEC Electronics Corp.
Rev. A.3 - Feb., 2004
APR3001/ 2/ 3
www.anpec.com.tw
13
Physical Specifications
t 25 C to Peak
tp
Ramp-up
t
L
Ramp-down
ts
Preheat
Tsmax
Tsmin
T
L
T
P
25
T
Time
Critical Zone
T
L
to T
P
Reflow Condition
(IR/Convection or VPR Reflow)
Classificatin R eflow Profiles
Sn-Pb Eutectic Assembly
Large Body
Pb-Free Assembly
Large Body
Profile Feature
Small Body
Small Body
Average ramp-up rate
(T
L
to T
P
)
Preheat
-
Temperature Min (Tsmin)
-
Temperature Mix (Tsmax)
-
Time (min to max)(ts)
Tsmax to T
L
- Ramp-up Rate
Tsmax to T
L
-
Temperature(T
L
)
-
Time (t
L
)
Peak Temperature(Tp)
Time within 5
°
C of actual Peak
Temperature(tp)
Ramp-down Rate
Time 25
°
C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
3
°
C/second max.
100
°
C
150
°
C
60-120 seconds
3
°
C/second max.
150
°
C
200
°
C
60-180 seconds
3
°
C/second max
217
°
C
60-150 seconds
245 +0/-5
°
C
183
°
C
60-150 seconds
225 +0/-5
°
C
240 +0/-5
°
C
250 +0/-5
°
C
10-30 seconds
10-30 seconds
10-30 seconds 20-40 seconds
6
°
C/second max.
6 minutes max.
6
°
C/second max.
8 minutes max.
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
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