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参数资料
| 型号： | APX9145EE-TR |
| 厂商： | Anpec Electronics Corporation |
| 英文描述： | High Sensitivity Hall Effect Sensor IC with FG Output |
| 中文描述： | 高灵敏度霍尔效应传感器IC输出的纤维蛋白原 |
| 文件页数： | 9/10页 |
| 文件大小： | 162K |
| 代理商： | APX9145EE-TR |
C opyright
ANPEC Electronics C orp.
Rev. A.2 - Nov., 2005
APX 91 45
www.anpec.com.tw
9
R eliability test prog ram
Test item
Method
Description
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
245
°
C , 5 SEC
1000 Hrs Bias @ 125
°
C
168 Hrs, 100 % RH , 121
°
C
-65
°
C ~ 150
°
C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , I
tr
> 100mA
Carrier Tape & Reel Dimensions
t
Ao
E
W
Po
P
Ko
Bo
D1
D
F
P1
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm
3
<350
<1.6 mm
260 +0
°
C*
1.6 mm – 2.5 mm
260 +0
°
C*
≥
2.5 mm
250 +0
°
C*
*Tolerance: The device manufacturer/supplier
shall
assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0
°
C.
For example 260
°
C+0
°
C) at the rated MSL level.
Volume mm
3
350-2000
260 +0
°
C*
250 +0
°
C*
245 +0
°
C*
Volume mm
3
>2000
260 +0
°
C*
245 +0
°
C*
245 +0
°
C*
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm
<350
240 +0/-5
°
C
225 +0/-5
°
C
Volume mm
3
3
350
225 +0/-5
°
C
225 +0/-5
°
C
<2.5 mm
≥
2.5 mm
Classificatin Reflow Profiles ( Cont.)
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