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参数资料
| 型号： | AQ1053N6S-T |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.0036 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP, 0402, ROHS COMPLIANT |
| 文件页数： | 8/18页 |
| 文件大小： | 804K |
| 代理商： | AQ1053N6S-T |
262
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
5/7
4.
1/2 1/3
100 130
20W
1
5.
1.
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
260
10
260
10
150
60
350
3
120
60
150
230
40
100
190
3216
130
3225
20W
1
300
200
100
0
300
200
100
0
400
300
200
100
0
Peak 260
max
10 sec max
Pb free soldering
Peak 260
max
10 sec max
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be reflow soldering for 2 times.
Ceramic chip components should be preheated to
within 100 to 130
of the soldering.
Assured to be wave soldering for 1 time.
Except for reflow soldering type.
T190
3216Type max ,
130
3225
Type ming
It is recommended to use 20W soldering iron and
the tip is 1 or less.
The soldering iron should not directly touch the
components.
Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Temperature
300
200
100
0
Temperature
300
200
100
0
Temperature
400
300
200
100
0
Preheating
150
60 sec min
Gradually
cooling
Gradually
cooling
Gradually
cooling
Heating above 230
40 sec max
Preheating
150
120 sec min
350
max
3 sec max
60 sec min
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| AQ1053N9S-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 3.90.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ1054N3S-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 4.30.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ1054N7S-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 4.70.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ1055N1S-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 5.10.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ1055N6C-T | 功能描述:FIXED IND 5.6NH 420MA 200 MOHM 制造商:taiyo yuden 系列:AQ 包装:- 零件状态:在售 类型:多层 材料 - 磁芯:- 电感:5.6nH 容差:±0.3nH 额定电流:420mA 屏蔽:无屏蔽 DC 电阻（DCR）:200 毫欧最大 不同频率时的 Q 值:8 @ 100MHz 频率 - 自谐振:4GHz 等级:- 工作温度:-55°C ~ 125°C 频率 - 测试:100MHz 特性:- 安装类型:表面贴装 封装/外壳:0402（1005 公制） 供应商器件封装:0402（1005 公制） 大小/尺寸:0.039" 长 x 0.024" 宽（1.00mm x 0.60mm） 高度 - 安装（最大值）:0.022"（0.55mm） 标准包装:10,000 |
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