- 您现在的位置：买卖IC网 > PDF目录16524 > AQ1056N8J-T (Taiyo Yuden)INDUCTOR 6.8NH 420MA 0402 SMD PDF资料下载
参数资料
| 型号： | AQ1056N8J-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 33/34页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR 6.8NH 420MA 0402 SMD |
| 产品目录绘图： | AQ105 Series Top AQ105 Series Side |
| 标准包装： | 10 |
| 系列： | AQ |
| 电感： | 6.8nH |
| 电流： | 510mA |
| 类型： | 陶瓷 |
| 容差： | ±5% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 230 毫欧 |
| Q因子@频率： | 8 @ 100MHz |
| 频率 - 自谐振： | 3.9GHz |
| 封装/外壳： | 0402（1005 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -55°C ~ 85°C |
| 频率 - 测试： | 100MHz |
| 其它名称： | 587-1987-6 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页当前第33页第34页
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
Recommended conditions for soldering Pb free soldering
［Reflow soldering］
Temperature profile
300
Preheating
60sec. 60sec
230℃
Within 10sec.
300
Peak
260℃ Max.
Within 10sec.
200
Min.
Min.
Slow cooling
200
Slow
cooling
100
100
Preheating150℃ Heating above
60sec. Min.
230℃
0
0
40sec. Max.
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
1/2T～1/3T
Inductor
Technical
considerations
Solder
PC board
T
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
Temperature profile
300
200
Preheating
120sec. Min.
230～250℃
Within 3sec.
300
200
120sec. Min.
Peak
260℃ Max.
Within 10sec.
Slow cooling
Preheating
Slow
cooling
100
0
100
0
150℃
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
Temperature profile
400
300
230～280℃
Within 3sec.
400
300
Peak
350℃ Max.
Within 3sec.
⊿T
Slow cooling
200
Slow cooling
200
Preheating
100
Preheating
100
150℃ Min.
0
60sec. Min.
0
60sec. Min.
（※⊿Ｔ≦190℃（ 3216Type max）, ⊿Ｔ≦130℃（ 3225 Type min）
※It is recommended to use 20W soldering iron and the tip is 1φ or less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E02R01
相关PDF资料 |
PDF描述 |
|---|---|
| H3DWH-6006G | IDC CABLE - HKR60H/AE60G/HPL60H |
| GEM22DTMI | CONN EDGECARD 44POS R/A .156 SLD |
| RCM11DREF | CONN EDGECARD 22POS .156 EYELET |
| GEM22DTBI | CONN EDGECARD 44POS R/A .156 SLD |
| MCP1320T-29LE/OT | IC SUPERVISOR 2.90V O-D SOT23-5 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AQ1057N5J-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 7.5nH 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ1058N2J-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 8.2nH 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ1059N1J-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0402 9.1nH 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| AQ105DY-C5-12-TR | 制造商:ACUTECH 制造商全称:ACUTECH 功能描述:Secondary V/I amplifier SOT23-5 and SC70-5 Package |
| AQ105DY-C5-12-TRL | 制造商:ACUTECH 制造商全称:ACUTECH 功能描述:Secondary V/I amplifier SOT23-5 and SC70-5 Package |
发布紧急采购，3分钟左右您将得到回复。