参数资料
| 型号： | ARE1303 |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 5/5页 |
| 文件大小： | 0K |
| 描述： | RELAY RF SPDT 500MA 3V |
| 其它有关文件： | Standards Chart |
| 标准包装： | 50 |
| 系列： | ARE |
| 继电器类型： | RF |
| 线圈类型： | 无锁存 |
| 线圈电流： | 66.7mA |
| 线圈电压： | 3VDC |
| 触点形式： | SPDT（1 C 型） |
| 触点额定值（电流）： | 500mA |
| 切换电压： | 30VDC - 最小值 |
| 关闭电压（最大）： | 2.25 VDC |
| 关闭电压（最小）： | 0.3 VDC |
| 安装类型： | 通孔 |
| 端接类型： | PC 引脚 |
| 包装： | 管件 |
| 触点材料： | 镀金 |
| 操作时间： | 10ms |
| 释放时间： | 5ms |
| 线圈功率： | 200 mW |
| 线圈电阻： | 45 欧姆 |
| 工作温度： | -40°C ~ 70°C |
RE (ARE)
? 75 ? type
CAD Data
(0.7)
(.028)
20.2
.795
Schematic (Top view)
NC
COM
NO
13.2 ± 0.5 11.2
.520 ± .020 .441
14 13 12 11 10 9 8
(1.3)
(.511)
Direction indication
(Deenergized condition)
1
7
8.6
.339
0.3
.012
0.3
.012
9.6
.378
0.3
.012
2.54
.100
0.5
.020
(1.49)
(.059)
7.62
.300
(2.09)
(.082)
General tolerance: ± 0.3 ± .012
Note: Please consult us regarding recommended PC board patterns.
NOTES
1. Coil operating power
(2) IR (infrared re?ow) soldering method
(1) Temperature:
Pure DC current should be applied to the
coil. The wave form should be
rectangular. If it includes ripple, the ripple
factor should be less than 5%.
However, check it with the actual circuit
T 3
T 1
T 2
T 1 = 155 to 165 ° C
311 to 329 ° F
T 2 = 180 to 200 ° C
356 to 392 ° F
T 3 = 245 ° C max.
473 ° F max.
–40 to +70°C –40 to +158°F
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the
temperature. Use within the range
since the characteristics may be slightly
different.
t 1
t 2
t 1 = within 120s
t 2 = within 30s
indicated in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
2. Cleaning
For automatic cleaning, the boiling
method is recommended. Avoid
ultrasonic cleaning which subjects the
relays to high frequency vibrations, which
may cause the contacts to stick.
It is recommended that alcoholic solvents
be used.
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of re?ow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and
the top surface of the relay case not to
exceed the above mentioned soldering
condition.
Temperature and humidity range for
usage, transport, and storage:
Humidity, %R.H.
85
Tolerance range
(Avoid freezing (Avoid
when used at condensation
3. Soldering
(Standard PC board terminal)
1) The manual soldering shall be
It is recommended to check the
temperature rise of each portion under
actual mounting condition before use.
temperatures
lower than
0 ° C 32 ° F )
5
when used at
temperatures
higher than
0 ° C 32 ° F )
performed under following condition.
Max. 260°C 500°F 10s
4. Packing style
1) Tape dimensions
–40
–40
0
+32
Temperature, ° C ° F
70
+158
1.75
2.0 ± 0.15 .006
.157
.016
.079 ±
20.75 .795 1.732
20.0
13.85
.417 + .008
21 ± 0.8 ± .031
Max. 350°C 662°F 3s
The affect of the PCB on the relay will
differ depending on the type of PCB
used. Please verify the type of PCB to be
used.
Preheat according to the following
conditions.
Temperature 120°C 248°F or less
Time Within 2 minute
Soldering should be done at 260±5°C
500±9°F within 6 s.
2) In case of automatic soldering, the
? ?
1.5 + 0.1 .059 + .004 dia.
4
Relay polarity bar .069
1.7 .817 40.4
.067 1.591
R0.75
.030 RE Relay
Tape coming out direction
2) Dimensions of plastic reel
dia.
.827 dia.
0.4
20.2 44 ± 0.3
± .012
? 0.3
1.5 .059 .787 .545 10.6 + 0.2
2) Condensation
Condensation forms when there is a
sudden change in temperature under
high temperature and high humidity
conditions. Condensation will cause
deterioration of the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0°C 32°F . This causes
problems such as sticking of movable
parts or operational time lags.
380 ± 0.2 ± .008
following conditions should be observed
(Surface-mount terminal)
Max. 95
3.740
13 ± 0.2 dia.
.512 ± .008 dia.
14.961
4) Low temperature, low humidity
environments
(1) Position of measuring temperature
A
2.0 ± 0.5
.079 ± .020
?
45.5 + 0.2
?
1.791 + .008
Max. 51.7
2.035
The plastic becomes brittle if the relay is
exposed to a low temperature, low
humidity environment for long periods of
time.
5. Conditions for operation, transport
A: Surface of PC board where relay is mounted.
and storage conditions
1) Ambient temperature, humidity, and
atmospheric pressure during usage,
transport, and storage of the relay:
For general cautions for use, please
refer to the “General Application
Guidelines”.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
ASCTB104E 201202-T
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