参数资料
型号: ARF477FL
厂商: MICROSEMI POWER PRODUCTS GROUP
元件分类: 功率晶体管
英文描述: 2 CHANNEL, VHF BAND, Si, N-CHANNEL, RF POWER, MOSFET
封装: ROHS COMPLIANT, CERAMIC PACKAGE-8
文件页数: 4/4页
文件大小: 145K
代理商: ARF477FL
050-4952
B
3-2010
ARF477FL
1.500
.300
.200
.005 .040
ARF477FL
.175
.150
.100
.320
.320 +/- .010
.570
1.250
.320
.125dia
4 pls
.125R
4 pls
.080
1.000
HAZARDOUS MATERIAL WARNING
The white ceramic portion of the device between leads
and mounting surface is beryllium oxide, BeO. Beryllium
oxide dust is toxic when inhaled. Care must be taken dur-
ing handling and mounting to avoid damage to this area.
These devices must never be thrown away with general
industrial or domestic waste.
Thermal Considerations and Package Mounting:
The rated power dissipation is only available when the package
mounting surface is at 25°C and the junction temperature is 175°C.
The thermal resistance between junctions and case mounting sur-
face is 0.23 °C/W. When installed, an additional thermal impe-
dance of 0.07°C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and
flat. Thermal joint compound must be used to reduce the effects of
small surface irregularities. Use the minimum amount necessary to
coat the surface. The heatsink should incorporate a copper heat
spreader to obtain best results.
The package design clamps the ceramic base to the heatsink. A
clamped joint maintains the required mounting pressure while al-
lowing for thermal expansion of both the base and the heat sink.
Four 4-40 (M3) screws provide the required mounting force. T = 6
in-lb (0.68 N-m).
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. US and Foreign patents pending. All Rights Reserved.
65MHz Test Circuit
相关PDF资料
PDF描述
ARF523-2112S DATACOM TRANSFORMER FOR 10/100/1000 BASE-T; ETHERNET APPLICATION(S)
ARH1617RGS DATACOM TRANSFORMER FOR 10/100 BASE-T; ETHERNET APPLICATION(S)
ARHNR-1605GS DATACOM TRANSFORMER FOR 10/100 BASE-T; ETHERNET APPLICATION(S)
ARHNR-1609GS DATACOM TRANSFORMER FOR 10/100 BASE-T; ETHERNET APPLICATION(S)
AS-19.6608-32-F-3PIN-H25-TR QUARTZ CRYSTAL RESONATOR, 19.6608 MHz
相关代理商/技术参数
参数描述
ARF477FL_10 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:RF POWER MOSFET N-CHANNEL PUSH - PULL PAIR
ARF500 12R J 功能描述:RES CHAS MNT 12 OHM 5% 500W 制造商:ohmite 系列:ARF 包装:散装 零件状态:在售 电阻值:12 Ohms 容差:±5% 功率(W):500W 成分:绕线 温度系数:±150ppm/°C 工作温度:0°C ~ 200°C 特性:脉冲耐受 涂层,外壳类型:铝 安装特性:螺钉孔 大小/尺寸:10.630" 长 x 3.110" 宽 (270.00mm x 79.00mm) 高度 - 安装(最大值):0.728"(18.50mm) 引线形式:导线引线 封装/外壳:矩形外壳 故障率:- 标准包装:1
ARF500 16R J 功能描述:RES CHAS MNT 16 OHM 5% 500W 制造商:ohmite 系列:ARF 包装:散装 零件状态:在售 电阻值:16 Ohms 容差:±5% 功率(W):500W 成分:绕线 温度系数:±150ppm/°C 工作温度:0°C ~ 200°C 特性:脉冲耐受 涂层,外壳类型:铝 安装特性:螺钉孔 大小/尺寸:10.630" 长 x 3.110" 宽 (270.00mm x 79.00mm) 高度 - 安装(最大值):0.728"(18.50mm) 引线形式:导线引线 封装/外壳:矩形外壳 故障率:- 标准包装:1
ARF500 68R J 功能描述:RES CHAS MNT 68 OHM 5% 500W 制造商:ohmite 系列:ARF 包装:散装 零件状态:在售 电阻值:68 Ohms 容差:±5% 功率(W):500W 成分:绕线 温度系数:±150ppm/°C 工作温度:0°C ~ 200°C 特性:脉冲耐受 涂层,外壳类型:铝 安装特性:螺钉孔 大小/尺寸:10.630" 长 x 3.110" 宽 (270.00mm x 79.00mm) 高度 - 安装(最大值):0.728"(18.50mm) 引线形式:导线引线 封装/外壳:矩形外壳 故障率:- 标准包装:1
AR-F5000 制造商:Stellar Labs Power 功能描述:Acer Ferrari Replacement Laptop Battery