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参数资料
| 型号： | AS1150-T |
| 厂商： | AUSTRIAMICROSYSTEMS AG |
| 元件分类： | LVDS |
| 英文描述： | Quad, LVDS, RX, 500Mbps; Package Type: TSSOP-16 |
| 中文描述： | 四路LVDS接收器 |
| 封装： | TSSOP-16 |
| 文件页数： | 13/15页 |
| 文件大小： | 417K |
| 代理商： | AS1150-T |
www.austriamicrosystems.com
Revision 1.19
13 - 15
AS1150/AS1151
Data Sheet - Package Drawings and Markings
10 Package Drawings and Markings
Figure 22. 16-Pin TSSOP Package
Notes:
1. All dimensions are in millimeters; angles in degrees.
2. Dimensions and tolerancing per
ASME Y14.5M-1994
.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15mm per side.
4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm
per side.
5. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of
dimension b at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm for 0.5mm pitch packages.
6. Terminal numbers shown are for reference only.
7. Datums A and B to be determined at datum plane H.
8. Dimensions D and E1 to be determined at datum plane H.
9. This dimension applies only to variations with an even number of leads per side. For variations with an odd number
of leads per package, the center lead must be coincident with the package centerline, datum A.
10. Cross section A-A to be determined at 0.10 to 0.25mm from the leadtip.
Symbol
0.65mm Lead Pitch
1, 2
Min
Nom
-
-
0.05
-
0.85
0.90
0.50
0.60
0.09
-
0.09
-
0.19
-
0.19
0.22
0.09
-
0.09
-
Note
Symbol
0.65mm Lead Pitch
1, 2
Min
Nom
0o
-
1.0 Ref
0.10
0.10
0.05
0.20
0.65 BSC
12o Ref
12o Ref
Note
Max
1.10
0.15
0.95
0.75
-
-
0.30
0.25
0.20
0.16
Max
8o
A
A1
A2
L
R
R1
b
b1
c
c1
θ
1
L1
aaa
bbb
ccc
ddd
e
θ
2
θ
3
5
Variations
3, 8
4, 8
D
E1
E
4.90
4.30
5.00
4.40
6.4 BSC
5.10
4.50
e
N
0.65 BSC
16
6
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AS1151 | 功能描述:IC LVDS QUAD RECEIVER 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| AS1151-T | 功能描述:IC LVDS RECEIVER QUAD 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| AS1152 | 功能描述:LVDS 接口集成电路 RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
| AS1152-T | 功能描述:IC LVDS RECEIVER QUAD 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:250 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:带卷 (TR) |
| AS1153 | 功能描述:LVDS 接口集成电路 RoHS:否 制造商:Texas Instruments 激励器数量:4 接收机数量:4 数据速率:155.5 Mbps 工作电源电压:5 V 最大功率耗散:1025 mW 最大工作温度:+ 85 C 封装 / 箱体:SOIC-16 Narrow 封装:Reel |
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