参数资料
型号: AS1323-BTTT-27
厂商: ams
文件页数: 12/15页
文件大小: 0K
描述: IC REG BOOST SYNC 2.7V TSOT23-5
设计资源: Design Support Tool
标准包装: 1
类型: 升压(升压)
输出类型: 固定
输出数: 1
输出电压: 2.7V
输入电压: 0.75 V ~ 2 V
电流 - 输出: 100mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: SOT-23-5 细型,TSOT-23-5
包装: 标准包装
供应商设备封装: TSOT-23-5
其它名称: AS1323-BTTT-27DKR
AS1323
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in an TSOT23-5 package.
Figure 22. TSOT23-5 Package
Symbol
Min
Typ
Max
Notes
Symbol
Min
Typ
Max
Notes
A
1.00
L
0.30
0.40
0.50
A1
A2
b
b1
0.01
0.84
0.30
0.31
0.05
0.87
0.35
0.10
0.90
0.45
0.39
L1
L2
N
R
0.10
0.60REF
0.25BSC
5
c
0.12
0.15
0.20
R1
0.10
0.25
c1
0.08
0.13
0.16
θ
0o
4o
8o
D
E
E1
e
e1
2.90BSC
2.80BSC
1.60BSC
0.95BSC
1.90BSC
3,4
3,4
3,4
θ 1
aaa
bbb
ccc
4o 10o 12o
Tolerances of Form and Position
0.15
0.25
0.10
ddd
0.20
Notes:
1. Dimensions are in millimeters.
2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed
0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15mm
per side. Dimensions D and E1 are determined at datum H.
3. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but include any mismatches between the top of the
package body and the bottom. D and E1 are determined at datum H.
Revision 1.07
11 - 14
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