参数资料
型号: AS1390A-ZQFT
厂商: ams
文件页数: 5/21页
文件大小: 0K
描述: IC BOOST CTLR/BUCK CONV 20-QFN
标准包装: 6,000
拓扑: 降压(降压),升压(升压)
输出数: 1
内部驱动器:
类型 - 主要: 背光
电源电压: 10 V ~ 30 V
安装类型: 表面贴装
封装/外壳: 20-VFQFN 裸露焊盘
供应商设备封装: 20-QFN(4x4)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
AS1390A, AS1390B
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Electrical Parameters
VDDH to AGND
VDDL to AGND
VDDM to AGND
40
5.0
20
V
V
V
VBIAS to AGND
PGND to AGND
EN_BOOST, FB_2D, FB_3D, FB_BUCK
VDDH - 5.0
-0.3
AGND - 0.3
VDDH + 0.3
+0.3
VDD + 0.3
V
V
V
Input Current (latch-up immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Human Body Model @ VDDH, VDDM, LX,
VBIAS, GATE, VDDHP
Human Body Model all other pins
4
2
kV
kV
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Junction Temperature (T J-MAX )
+150
oC
Storage Temperature Range
-65
+150
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Package Body Temperature
+260
oC
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
www.austriamicrosystems.com/Power-Management/AS1390
1
3
Revision 1.04
Represents a max. floor life time of unlimited
for 20-Pin QFN (4x4mm)
Represents a max. floor life time of 168h
for 16-pin SOIC
4 - 20
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