参数资料
型号: AS1753S-T
厂商: ams
文件页数: 12/17页
文件大小: 0K
描述: IC SWITCH QUAD SPST 14-TSSOP
标准包装: 2,500
功能: 开关
电路: 4 x SPST - NC/NO
导通状态电阻: 900 毫欧
电压电源: 单电源
电压 - 电源,单路/双路(±): 1.6 V ~ 3.6 V
电流 - 电源: 100nA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 14-TSSOP
包装: 带卷 (TR)
www.austriamicrosystems.com
Revision 1.41
3 - 16
AS1751/AS1752/AS1753
Data Sheet - Ab solute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Signals on pins COM1, COM3, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes. For-
ward-diode current should be limited to the maximum current rating.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
V+, INx to GND
-0.3
+5
V
COMx, NOx, NCx to GND
-0.3
V+
+ 0.3
V
COMx, NOx, NCx Continuous Current
-250
+250
mA
COMx, NOx, NCx Peak Current
-350
+350
mA
Pulsed at 1ms 10% duty cycle
Continuous Power
Dissipation (TAMB = +70C)
16-pin TQFN
727
mW
Derate at 9.1W/C above +70C
14-pin TSSOP
1349
Derate at 16.9W/C above +70C
Operating Temperature Range
-40
+85
C
Electro-Static Discharge
2500
V
HBM Mil-Std883E 3015.7 methods
Latch Up Immunity
250
mA
Norm: JEDEC 17
Junction Temperature
+150
C
Storage Temperature Range
-65
+150
C
Package Body Temperature
+260
C
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”
ams
AG
Technical
content
still
valid
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