参数资料
型号: AS1908-C23-T
厂商: ams
文件页数: 3/10页
文件大小: 0K
描述: IC SUPERVISOR ACT HIGH SOT23-3
标准包装: 1
类型: 简单复位/加电复位
监视电压数目: 1
输出: 推挽式,图腾柱
复位: 高有效
复位超时: 最小为 100 ms
电压 - 阀值: 2.3V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3
包装: 标准包装
其它名称: AS1908-C23-TDKR
AS1907/AS1908/AS1909
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
V CC to GND
Open-Drain RESETN
Push/Pull RESET, RESETN
Input Current (V CC )
Output Current (RESET, RESETN)
-0.3
-0.3
-0.3
+5.0
+6.0
V CC +
0.3
20
20
V
V
V
mA
mA
Electrostatic Discharge
Electrostatic Discharge HBM
±1
kV
Norm: MIL 883 E Method 3015
Continuous Power Dissipation
Continuous Power Dissipation
(T AMB = +70oC)
320
mW
3-pin SOT23 derate 4mW/oC above +70oC
Temperature Ranges and Storage Conditions
Junction Temperature
+150
oC
Storage Temperature Range
-55
+150
oC
Package Body Temperature
+260
oC
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
8
85
%
Moisture Sensitive Level
www.ams.com/Supervisors/AS1907-09
1
Revision 1.8
Represents a maximum floor life time of unlimited
3 - 10
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