参数资料
型号: AS1976-T
厂商: ams
文件页数: 13/18页
文件大小: 0K
描述: IC COMPARATOR PUSH/PULL SOT23-5
标准包装: 1
类型: 通用
元件数: 1
输出类型: CMOS,推挽式,满摆幅
电压 - 电源,单路/双路(±): 1.8 V ~ 5.5 V
电压 - 输入偏移(最小值): 5mV @ 5V
电流 - 输入偏压(最小值): 0.001µA @ 5V
电流 - 输出(标准): 50mA
电流 - 静态(最大值): 500nA
CMRR, PSRR(标准): 74dB CMRR,86.02dB PSRR
传输延迟(最大): 15ns
磁滞: 3mV
工作温度: -40°C ~ 85°C
封装/外壳: SC-74A,SOT-753
安装类型: 表面贴装
包装: 标准包装
其它名称: AS1976-TDKR
www.austriamicrosystems.com
Revision 1.01
3 - 17
AS1976/AS1977
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Supply Voltage VCC to VEE
+7
V
Voltage Inputs IN+, IN-
VEE
- 0.3
VCC
+ 0.3
V
Output Voltage AS1976, AS1978
VEE
- 0.3
VCC
+ 0.3
V
Output Current
-50
+50
mA
Output Short-Circuit Duration
10
s
Continuous Power Dissipation
571
mW
Derate at 7.31mW/C above +70C
Operating Temperature Range
-40
+85
C
Storage Temperature Range
-65
+150
C
Package Body Temperature
+260
C
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020C “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
ams
AG
Technical
content
still
valid
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