参数资料
型号: ASMD050F-2
厂商: TE Connectivity
文件页数: 16/26页
文件大小: 0K
描述: POLYSWITCH PTC RESET .39A HOLD
产品培训模块: Circuit Protection Products
标准包装: 2,000
系列: PolySwitch®
电流 - 维持(Ih): 370mA
电流 - 跳闸(It): 980mA
电流 - 最大: 10A
电压 - 最大: 60V
R最小/最大: 0.290 ~ 1.400 欧姆
跳闸时间: 20s
封装/外壳: 2-SMD
包装: 带卷 (TR)
其它名称: ASMD050F-2-ND
ASMD050FTR
RF0609-000
RF1632-000
Table A5 Physical Characteristics and Environmental Specifications for Automotive Devices
AGRF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
AGRF400 to AGRF1100 : Tin Plated Copper, 0.52mm 2 (20AWG) ? 0.8 mm/0.032in
AGRF1200 to AGRF1400 : Tin Plated Copper, 0.82mm 2 (18AWG) ? 1.0mm/0.040in
Solderability per ANSI/J-STD-002 Category 3
AGRF400: per IEC68-2-20 Test Tb, Method 1A, Condition A: can withstand 5 seconds at 260°C ± 5°C
AGRF500-AGRF1400: per IEC68-2-20 Test Tb, Method 1A, Condition B: can withstand 10 seconds at 260°C ± 5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
-40°C~85°C
Note: See PS400 for other physical characteristics.
Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85% RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Note: See PS400 for other environmental specifications.
AHRF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
AHRF050 to AHRF200 : Tin-plated Copper Clad Steel, 0.205mm 2 (24 AWG), ? 0.51mm/0.020in
AHRF300 to AHRF1100 : Tin-plated copper 0.52mm 2 (20 AWG), ? 0.81mm/0.032 in
AHRF1300 to AHRF1500 : Tin-plated copper 0.82mm 2 (18 AWG), ? 1.0mm/0.04 in
Solderability per ANSI/J-STD 002 Category 3
per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ± 5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
-40°C~125°C
Note: See PS400 for other physical characteristics.
Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85% RH, 1000 hours
125°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
12
Note: See PS400 for other environmental specifications.
AHEF
Physical Characteristics
Lead material
AHEF050 to AHEF100 : Tin-plated Copper Clad Steel, 0.205mm 2 (24 AWG), ? 0.51mm/0.020in.
AHEF300 to AHEF750 : Tin-plated Copper 0.52mm 2 (20 AWG), ? 0.81mm/0.032in
AHEF1000
: Tin-plated copper 0.82mm 2 (18 AWG), ? 1.0mm/0.04 in
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
Solderability per ANSI/J-STD 002 Category 3
per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ± 5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
-40°C~125°C
Note: See PS400 for other physical characteristics.
Devices are not designed to be placed through a reflow process.
188
RoHS Compliant, ELV Compliant
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