参数资料
型号: AT17LV256-10SC
厂商: Atmel
文件页数: 13/26页
文件大小: 0K
描述: IC SRL CONFG EEPROM 256K 20SOIC
标准包装: 38
可编程类型: 串行 EEPROM
存储容量: 256Kb
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
工作温度: 0°C ~ 70°C
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC W
包装: 管件
其它名称: AT17LV25610SC
20
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
23.2
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A
0.210
2
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
3
D1
0.005
3
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
e
0.100 BSC
eA
0.300 BSC
4
L
0.115
0.130
0.150
2
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