参数资料
型号: AT24C01A-10TU-1.8
厂商: Atmel
文件页数: 15/27页
文件大小: 0K
描述: IC EEPROM 1KBIT 400KHZ 8TSSOP
标准包装: 100
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 1K (128 x 8)
速度: 100kHz,400kHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 管件
AT24C01A/02/04/08A/16A
AT24C04 Ordering Information (1)
AT24C04-10PU-2.7
Ordering Code
(2)
AT24C04-10PU-1.8 (2)
AT24C04N-10SU-2.7 (2)
AT24C04N-10SU-1.8 (2)
AT24C04-10TU-2.7 (2)
AT24C04-10TU-1.8 (2)
AT24C04Y1-10YU-1.8 (2) (Not recommended for new design)
AT24C04Y6-10YH-1.8 (3)
AT24C04-10TSU-1.8 (2)
AT24C04U3-10UU-1.8 (2)
AT24C04-W1.8-11 (4)
Package
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y6
5TS1
8U3-1
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40 ° C to 85 ° C)
Industrial Temperature
(–40 ° C to 85 ° C)
Notes:
8P3
8S1
8A2
8Y1
8Y6
5TS1
8U3-1
– 2.7
– 1.8
1.
2.
3.
4.
For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
“U” designates Green Package + RoHS compliant.
“H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
15
0180Z1–SEEPR–5/07
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相关代理商/技术参数
参数描述
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