参数资料
| 型号： | AT24C01BY6-YH-T |
| 厂商： | Atmel |
| 文件页数： | 22/25页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 1KBIT 1MHZ 8DFN |
| 标准包装： | 1 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 1K (128 x 8) |
| 速度： | 400kHz，1MHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-UDFN 裸露焊盘 |
| 供应商设备封装： | 8-MLP（2x3） |
| 包装： | 剪切带 (CT) |
| 其它名称： | AT24C01BY6-YH-TCT |
12. 5TS1 – SOT23
e1
L
E1
5
4
E
C
C
L1
Seating
1
2
Top View
b
3
A2
A
End View
Plane
e
D
Side View
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
SYMBOL
A
A1
A2
c
D
E
E1
MIN
–
0.00
0.70
0.08
NOM
–
–
0.90
–
2.90 BSC
2.80 BSC
1.60 BSC
MAX
1.10
0.10
1.00
0.20
NOTE
4
2, 3
2, 3
2, 3
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
L1
e
e1
0.60 REF
0.95 BSC
1.90 BSC
shall not be less than 0.07 mm.
b
0.30
–
0.50
4, 5
6/25/03
1150 E. Cheyenne Mtn. Blvd.
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
DRAWING NO.
REV.
R
Colorado Springs, CO 80906
Small Outline Package (SHRINK SOT)
PO5TS1
A
22
AT24C01B
5156E–SEEPR–10/08
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AT24C01C-CUM-T | 制造商:Atmel Corporation 功能描述: |
| AT24C01C-MAHM-T | 制造商:Atmel Corporation 功能描述:SERIAL EEPROM, 1K (128 X 8), 2-WIRE - 8 UDFN, PB/HALO FREE, - Tape and Reel 制造商:Atmel 功能描述:SERIAL EE 制造商:Atmel Corporation 功能描述:IC EEPROM 1KBIT 8UDFN 1.7V 制造商:Atmel Corporation 功能描述:1K 2-WIRE 8 UDFN, PB HALOFREE NiPdAu 1.7V 制造商:Atmel 功能描述:EEPROM Serial-2Wire 1K-bit 128 x 8 1.8V/2.5V/3.3V/5V 8-Pin UDFN EP T/R |
| AT24C01C-PUM | 制造商:Atmel Corporation 功能描述:EEPROM Serial-2Wire 1K-bit 128 x 8 1.8V/2.5V/3.3V/5V 8-Pin PDIP W Bulk 制造商:Atmel Corporation 功能描述:SERIAL EEPROM, 1K (128 X 8), 2-WIRE - 8 PDIP, PB/HALO FREE, - Rail/Tube 制造商:Atmel Corporation 功能描述:IC EEPROM 1KBIT 8PDIP 1.7V 制造商:Atmel Corporation 功能描述:1K 2-WIRE 8 PDIP PB/HALO FREE, 1.7V |
| AT24C01C-SSHM-B | 功能描述:电可擦除可编程只读存储器 1K 2-WIRE 8 SOIC PB HALOFREE NiPdAu 1.7V RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| AT24C01C-SSHM-T | 功能描述:电可擦除可编程只读存储器 1K 2-WIRE 8 SOIC PB HALOFREE NiPdAu 1.7V RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
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