参数资料
型号: AT24C128Y1-10YU-1.8
厂商: Atmel
文件页数: 14/23页
文件大小: 0K
描述: IC EEPROM 128KBIT 400KHZ 8MAP
标准包装: 120
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 128K (16K x 8)
速度: 100kHz,400kHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UDFN 裸露焊盘
供应商设备封装: 8-MAP(3x4.9)
包装: 管件
AT24C256 Ordering Information (1)
Ordering Code
AT24C256-10PU-2.7 (2)
AT24C256-10PU-1.8 (2)
AT24C256N-10SU-2.7 (2)
AT24C256N-10SU-1.8 (2)
AT24C256W-10SU-2.7 (2)
AT24C256W-10SU-1.8 (2)
AT24C256-10TU-2.7 (2)
AT24C256-10TU-1.8 (2)
AT24C256U2-10UU-1.8 (2)
AT24C256Y1-10YU-1.8 (2)
AT24C256Y4-10YU-1.8 (2)
AT24C256-W1.8-11 (3)
Package
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y1
8Y4
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40 ° C to 85 ° C)
Industrial Temperature
(–40 ° C to 85 ° C)
Notes:
8P3
8S1
8S2
8U2-1
8Y1
8Y4
8A2
– 2.7
– 1.8
14
1. This device is not recommended for new design. Please refer to AT24C256B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
AT24C128/256
0670T–SEEPR–3/07
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