参数资料
型号: AT25256A-10TU-2.7
厂商: Atmel
文件页数: 21/24页
文件大小: 0K
描述: IC EEPROM 256KBIT 20MHZ 8TSSOP
标准包装: 100
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 256K (32K x 8)
速度: 10MHz,20MHz
接口: SPI 3 线串行
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 管件
其它名称: AT25AT256A-10TU-2.7 SL383
AT25AT256A-10TU-2.7 SL383-ND
AT25128A_256A
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
b
A
D
E
E1
2.90
4.30
3.00
6.40 BSC
4.40
3.10
4.50
2, 5
3, 5
A
1.20
e
A2
A2
0.80
1.00
1.05
D
b
0.19
0.30
4
e
0.65 BSC
Side View
L
0.45
0.60
0.75
L1
1.00 REF
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
TITLE
DRAWING NO.
REV.
R
2325 Orchard Parkway
San Jose, CA 95131
8A2 , 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
8A2
B
21
3368J–SEEPR–06/07
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AT25256AN-10SI-1.8-T 功能描述:IC EEPROM 256KBIT 20MHZ 8SOIC 制造商:microchip technology 系列:- 包装:带卷(TR) 零件状态:停產 存储器类型:非易失 存储器格式:EEPROM 技术:EEPROM 存储容量:256Kb (32K x 8) 时钟频率:20MHz 写周期时间 - 字,页:5ms 存储器接口:SPI 电压 - 电源:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C(TA) 安装类型:表面贴装 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商器件封装:8-SOIC 基本零件编号:AT25256 标准包装:3,000
AT25256AN-10SI-2.7 功能描述:IC EEPROM 256KBIT 20MHZ 8SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:96 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:16M(2M x 8,1M x 16) 速度:70ns 接口:并联 电源电压:2.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘
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