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参数资料
| 型号： | AT25HP512-10PI-2.7 |
| 厂商： | Atmel |
| 文件页数： | 18/21页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 512KBIT 10MHZ 8DIP |
| 标准包装： | 50 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 512K (64K x 8) |
| 速度： | 5MHz，10MHz |
| 接口： | SPI 3 线串行 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
| 其它名称： | AT25HP512-10PI2.7 |
16S2 – JEDEC SOIC
C
1
Top View
N
E
H
A1
End View
e
b
COMMON DIMENSIONS
(Unit of Measure = inches)
D
Side View
A
SYMBOL
A
A1
b
C
D
E
H
L
MIN
0.0926
0.0040
0.0130
0.0091
0.3977
0.2914
0.3940
0.0160
NOM
–
–
–
–
–
–
–
–
MAX
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
0.4190
0.050
NOTE
5
2
3
4
e
0.050 BSC
Notes: 1. This drawing is for general information only; refer to JEDEC drawing MS-013, Variation AA, for additional information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
3. Dimension E does not include inter-lead Flash or protrusion. Inter-lead Flash and protrusions shall not exceed 0.25 mm
4.
5. The lead width B, as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm
(0.024") per side.
1/9/02
TITLE
DRAWING NO.
REV.
R
2325 Orchard Parkway
San Jose, CA 95131
16S2 , 16-lead, 0.300" Wide Body, Plastic Gull
Wing Small Outline Package (SOIC)
16S2
A
18
AT25HP256/512
1113L–SEEPR–3/06
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AT25HP512-10PU-1.8 | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:SPI Serial EEPROMs |
| AT25HP512-10PU-2.7 | 制造商:Atmel Corporation 功能描述:EEPROM Serial-SPI 512K-Bit 64K x 8 3.3V/5V 8-Pin PDIP |
| AT25HP512C1-10CC | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:SPI Serial EEPROMs |
| AT25HP512C1-10CC-1.8 | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:SPI Serial EEPROMs |
| AT25HP512C1-10CC-2.7 | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:SPI Serial EEPROMs |
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